Comparison of grazing incidence and grazing emission X-ray fluorescence analysis technologies

CHEN Xue-liang; GONG Yan; Chen Bo

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Comparison of grazing incidence and grazing emission X-ray fluorescence analysis technologies

更新时间：2020-08-12

- Comparison of grazing incidence and grazing emission X-ray fluorescence analysis technologies
- Optics and Precision Engineering Vol. 12, Issue 2, Pages: 174-178(2004)
- 作者机构：
  
  中国科学院, 长春光学精密机械与物理研究所, 应用光学国家重点实验室,吉林长春,130033
- 作者简介：
- 基金信息：
- DOI：
  CLC： TH744.16
- Received：06 December 2003，
  
  Revised：17 January 2004，
  
  Published Online：15 April 2004，
  
  Published：15 April 2004
- 稿件说明：
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陈雪亮, 巩岩, 陈波. 掠出射X射线荧光分析技术与掠入射X射线荧光分析技术[J]. 光学精密工程, 2004,(2): 174-178

CHEN Xue-liang, GONG Yan, CHEN Bo. Comparison of grazing incidence and grazing emission X-ray fluorescence analysis technologies[J]. Editorial Office of Optics and Precision Engineering, 2004,(2): 174-178
陈雪亮, 巩岩, 陈波. 掠出射X射线荧光分析技术与掠入射X射线荧光分析技术[J]. 光学精密工程, 2004,(2): 174-178 DOI：

CHEN Xue-liang, GONG Yan, CHEN Bo. Comparison of grazing incidence and grazing emission X-ray fluorescence analysis technologies[J]. Editorial Office of Optics and Precision Engineering, 2004,(2): 174-178 DOI：

摘要

依据工作原理

比较了掠出射X射线荧光分析技术(GEXRF)和掠入射X射线荧光分析技术(GI-XRF)的优缺点

比较角度包括实验装置、探测限、可探测元素范围、基体效应以及实验精度.比较结果表明

GEXRF的优点体现为:对实验装置要求低

对轻元素(4＜Z＜20)特别灵敏

能对大样品进行检测

实验精度高;缺点体现为:临界厚度小

探测限高."对轻元素特别灵敏"的特点决定了GEXRF的应用领域将主要集中在化学元素微量和痕量分析以及半导体工业中Si薄膜表面轻元素检测等方面.

Abstract

The grazing emission X-ray fluorescence(GEXRF)technology is compared with the grazing incidence X-ray fluorescence(GI-XRF)technology in terms of experimental set-up detection limit

range of elements accessible

matrix effect and accuracy.The results of comparison demonstrate that while it has the disadvantages of higher detection limitation and thinner critical thickness

GEXRF has the advantages of lower requirements for experimental set-up

more sensitivity to light elements(4<Z<20)

ability to analyze large sample with better accuracy.The special feature of”being more sensitivity to light elements”decides that the micro-and trace analysis of chemical elements and the determination of low-Z elements on silicon wafer in semiconductor industry are the most potential applications of the technology.

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references

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