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Double-pulse picosecond lasers and mechanical cleaving combined cutting process for SiC
Micro\/Nano Technology and Fine Mechanics | 更新时间：2026-07-22

    • Double-pulse picosecond lasers and mechanical cleaving combined cutting process for SiC

    • Optics and Precision Engineering   Vol. 34, Issue 13, Pages: 2033-2049(2026)

    • DOI：10.37188/OPE.20263413.2033    

      CLC： TN249
    • CSTR：32169.14.OPE.20263413.2033    

    • Received：19 April 2026，

      Revised：2026-05-12，

      Online First：20 July 2026，

      Published：10 July 2026

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  • ZHAO Yuanhao,YAO Peng,CHU Dongkai,et al.Double-pulse picosecond lasers and mechanical cleaving combined cutting process for SiC[J].Optics and Precision Engineering,2026,34(13):2033-2049.

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Related Author

YAO Peng
QU Shuoshuo
CHU Dongkai
HU Shuangshuang
LIU Yuhao
TANG Zhiliang
Xiaowen CAO
Ji WANG

Related Institution

School of Mechanical Engineering， Qilu University of Technology （Shandong Academy of Sciences）
Key Laboratory of High Efficiency and Clean Mechanical Manufacture， Shandong University， Ministry of Education
Ningbo Da'ai Laser Technology Co.， Ltd
Ningbo Insitute of Materials Technology and Engineering， Chinese Academy of Sciences
Department of Precision Machinery and Precision Instrumentation， University of Science and Technology of China
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