minimum feature size of 70 nm on wafer is required. Research in U.S.
Japan and Europe is aimed at developing and demonstrating an EUVL tool for critical feature size of 70 nm and below. In Japan
Himeji institute of technology (HIT) has developed an EUVL laboratory tool
which has a practical exposure field of 30mm?28mm. The alignment and assembly of three aspherical mirror optics were completed. A final wave front error of less than 3 nm was achieved. Using this system
exposure experiments are performed using synchrotron facility of New Subaru. Up to now
56nm patterns have been replicated in the exposure field of 10mm?1mm. And using scanning stages
100 nm L & S patterns have been replicated in the field of 10mm?5 mm.
Abstract
According to the SIA roadmap
by the year of 2006
minimum feature size of 70 nm on wafer is required. Research in U.S.
Japan and Europe is aimed at developing and demonstrating an EUVL tool for critical feature size of 70 nm and below. In Japan
Himeji institute of technology (HIT) has developed an EUVL laboratory tool
which has a practical exposure field of 30mm?28mm. The alignment and assembly of three aspherical mirror optics were completed. A final wave front error of less than 3 nm was achieved. Using this system
exposure experiments are performed using synchrotron facility of New Subaru. Up to now
56nm patterns have been replicated in the exposure field of 10mm?1mm. And using scanning stages
100 nm L & S patterns have been replicated in the field of 10mm?5 mm.