This work is focused on design and fabrication of a hybrid-type electrostatic silicon microgripper integrated vacuum tool. Vacuum tools are integrated in this novel microgripper in order to improve its pick and place capability. Bulk micromachining technology is employed to fabricate the microgripper from single crystal silicon wafer. The gas circuit controlling and electrical subsystems are designed for the microgripper controlling. At a driving voltage of 80V

a deflection of 25μm at the arm tip of the gripper is achieved. Two different dimensions of the grippers are designed. One gripper is able to pick and place objects of a size ranging from 100μm to 150μm and the other is able to operate objects ranging from 150μm to 200μm.The objects ranging from 100μm to 200μm are picked and placed successfully in the experiment

the experiment indicate that this microgripper can realize the steady manipulation.