Measurement of through silicon via by near-infrared micro interferometry based on aberration compensation

WU Chunxia; MA Jianqiu; GAO Zhishan; GUO Zhenyan; YUAN Qun

doi:10.37188/OPE.20233103.0301

您当前的位置：

首页 >

文章列表页 >

Measurement of through silicon via by near-infrared micro interferometry based on aberration compensation

Modern Applied Optics | 更新时间：2023-02-15

- Measurement of through silicon via by near-infrared micro interferometry based on aberration compensation
- Optics and Precision Engineering Vol. 31, Issue 3, Pages: 301-312(2023)
- 作者机构：
  
  南京理工大学电子工程与光电技术学院，江苏南京 210094
- 作者简介：
- 基金信息：
- DOI：10.37188/OPE.20233103.0301
  CLC： O436.1;TH744
- Received：08 September 2022，
  
  Revised：11 October 2022，
  
  Published：10 February 2023
- 稿件说明：
移动端阅览
吴春霞,马剑秋,高志山等.基于像差补偿的近红外显微干涉硅通孔测量[J].光学精密工程,2023,31(03):301-312.

WU Chunxia,MA Jianqiu,GAO Zhishan,et al.Measurement of through silicon via by near-infrared micro interferometry based on aberration compensation[J].Optics and Precision Engineering,2023,31(03):301-312.
吴春霞,马剑秋,高志山等.基于像差补偿的近红外显微干涉硅通孔测量[J].光学精密工程,2023,31(03):301-312. DOI： 10.37188/OPE.20233103.0301.

WU Chunxia,MA Jianqiu,GAO Zhishan,et al.Measurement of through silicon via by near-infrared micro interferometry based on aberration compensation[J].Optics and Precision Engineering,2023,31(03):301-312. DOI： 10.37188/OPE.20233103.0301.

摘要

为了实现深宽比大于6∶1的硅通孔的形貌测量，提出了一种基于像差补偿的近红外显微干涉检测方法。该方法采用近红外宽带光作为光源，能够穿透硅通孔，检测系统中内置变形镜自适应像差补偿模块，主动补偿硅通孔引入的调制像差。在检测硅通孔三维形貌时，依据COMSOL Multiphysics有限元仿真软件得到的三维硅通孔高深宽比结构对探测光的调制像差规律，指导设置需变形镜补偿的像差种类和量值，用基于频域的评价函数指标阈值，判定硅通孔底部图像的聚焦状态，获得待测硅通孔清晰的底部图像，本质上提升探测光的重聚焦能力。在此基础上，使用垂直扫描干涉法得到待测硅通孔的深度与其三维形貌分布。实验测量了直径为10 μm、深度为65 μm、深宽比为6.5∶1和直径为10 μm、深度为103 μm、深宽比为10.3∶1的硅通孔深孔，并与高精度SEM的测量结果对比，深度测量的相对误差为1%。与白光显微干涉测量结果对比表明，本文所提出的方法可以获得清晰的高深宽比硅通孔的底部图像，有效增强底部的宽谱干涉信号和对比度，能够准确测量更高深宽比硅通孔的三维形貌。

Abstract

Through silicon via （TSV） technology refers to the silicon micro-hole processing technology used to achieve vertical conduction and interconnection between chips. The three-dimensional （3D） morphology of TSV samples is commonly measured using destructive scanning electron microscope （SEM） profile imaging technology. In addition， white light interference technology has the advantage of non-destructive measurement； however， it is difficult to probe the light reaching the bottom of TSV samples with an aspect ratio higher than 6：1， and the topography is also distorted. To address this problem， a near-infrared micro-interference detection method based on aberration compensation is proposed in this paper. The method uses near-infrared broadband light as the probe light source， which can penetrate through the TSV. Moreover， an adaptive aberration compensation module in the form of a deformable mirror is introduced into the detection system to compensate for the modulation aberration that is synchronously generated by the TSV. The first step of detecting the TSV 3D topography is to set the type and quantity of the aberration that needs to be compensated by the deformable mirror. This is obtained using the finite element simulation software COMSOL Multiphysics based on the aberration modulation law for a 3D TSV high aspect ratio structure under the probe light. Subsequently， the evaluation function index threshold based on the frequency domain is used to estimate the focus state of the TSV bottom image. Furthermore， the refocusing ability of the probe light is essentially improved and a clear bottom image of the tested TSV is obtained. On this basis， the depth value of the tested TSV and its 3D topography distribution is calculated using vertical scanning interferometry. Finally， two types of TSV samples with a diameter of 10 μm and depth of 65 μm （aspect ratio 6.5）， and diameter of 10 μm and depth of 103 μm （aspect ratio 10.3）， are measured using the proposed method. The results show that the relative error of depth measurement is 1% compared with that of the high-precision SEM measurement results. Moreover， the proposed method can obtain a clear image of the TSV bottom with a high aspect ratio， and can also effectively enhance the wide spectrum interference signal and fringe contrast at the bottom compared with white light microscopic interference. Therefore， the proposed method can be used to precisely measure the 3D topography of TSVs with a higher aspect ratio.

关键词

Keywords

references

PAK J S ， RYU C ， KIM J . Electrical characterization of trough silicon via （TSV） depending on structural and material parameters based on 3D full wave simulation ［C］. 2007 International Conference on Electronic Materials and Packaging . 1922，2007 ， Daejeon ， Korea （South） . IEEE ， 2008 ： 1 - 6 . doi: 10.1109/emap.2007.4510331 http://dx.doi.org/10.1109/emap.2007.4510331

KIM H ， CHO J ， KIM M ， et al . Measurement and analysis of a high-speed TSV channel ［J］. IEEE Transactions on Components， Packaging and Manufacturing Technology ， 2012 ， 2 （ 10 ）： 1672 - 1685 . doi: 10.1109/tcpmt.2012.2207900 http://dx.doi.org/10.1109/tcpmt.2012.2207900

李智，王向军 . MEMS中几何量的测试方法［J］. 微细加工技术， 2003 （ 1 ）： 51 - 56 . doi: 10.3321/j.issn:1004-924X.2003.01.007 http://dx.doi.org/10.3321/j.issn:1004-924X.2003.01.007

LI ZH ， WANG X J . Measurement methods of geometric characteristics in MEMS ［J］. Microfabrication Technology ， 2003 （ 1 ）： 51 - 56 . （in Chinese） . doi: 10.3321/j.issn:1004-924X.2003.01.007 http://dx.doi.org/10.3321/j.issn:1004-924X.2003.01.007

GARCı́A R ， PÉREZ R . Dynamic atomic force microscopy methods ［J］. Surface Science Reports ， 2002 ， 47 （ 6/7/8 ）： 197 - 301 . doi: 10.1016/s0167-5729(02)00077-8 http://dx.doi.org/10.1016/s0167-5729(02)00077-8

JO T ， KIM S ， PAHK H . 3D measurement of TSVs using low numerical aperture white-light scanning interferometry ［J］. Journal of the Optical Society of Korea ， 2013 ， 17 （ 4 ）： 317 - 322 . doi: 10.3807/josk.2013.17.4.317 http://dx.doi.org/10.3807/josk.2013.17.4.317

HYUN C ， KIM S ， PAHK H . Methods to measure the critical dimension of the bottoms of through-silicon vias using white-light scanning interferometry ［J］. Journal of the Optical Society of Korea ， 2014 ， 18 （ 5 ）： 531 - 537 . doi: 10.3807/josk.2014.18.5.531 http://dx.doi.org/10.3807/josk.2014.18.5.531

薛晨阳，孔繁华，张文栋，等 . 利用白光干涉原理测量MEMS深槽结构［J］. 传感技术学报， 2006 ， 19 （ 5 ）： 1516 - 1518， 1522 . doi: 10.3969/j.issn.1004-1699.2006.05.054 http://dx.doi.org/10.3969/j.issn.1004-1699.2006.05.054

XUE CH Y ， KONG F H ， ZHANG W D ， et al . Measuring MEMS deep-trench structures with white light interference ［J］. Chinese Journal of Sensors and Actuators ， 2006 ， 19 （ 5 ）： 1516 - 1518， 1522 . （in Chinese） . doi: 10.3969/j.issn.1004-1699.2006.05.054 http://dx.doi.org/10.3969/j.issn.1004-1699.2006.05.054

AHN H ， PARK J ， KIM J A ， et al . Optical fiber-based confocal and interferometric system for measuring the depth and diameter of through silicon vias ［J］. Journal of Lightwave Technology ， 2016 ， 34 （ 23 ）： 5462 - 5466 . doi: 10.1109/jlt.2016.2618419 http://dx.doi.org/10.1109/jlt.2016.2618419

AHN H ， BAE J ， PARK J ， et al . A hybrid non-destructive measuring method of three-dimensional profile of through silicon vias for realization of smart devices ［J］. Scientific Reports ， 2018 ， 8 ： 15342 . doi: 10.1038/s41598-018-33728-w http://dx.doi.org/10.1038/s41598-018-33728-w

JIN J ， KIM J W ， KANG C S ， et al . Precision depth measurement of through silicon vias （TSVs） on 3D semiconductor packaging process ［J］. Optics Express ， 2012 ， 20 （ 5 ）： 5011 - 5016 . doi: 10.1364/oe.20.005011 http://dx.doi.org/10.1364/oe.20.005011

KU Y S ， HUANG K C ， HSU W . Characterization of high density through silicon vias with spectral reflectometry ［J］. Optics Express ， 2011 ， 19 （ 7 ）： 5993 - 6006 . doi: 10.1364/oe.19.005993 http://dx.doi.org/10.1364/oe.19.005993

KU Y S ， YANG F S . Reflectometer-based metrology for high-aspect ratio via measurement ［J］. Optics Express ， 2010 ， 18 （ 7 ）： 7269 - 7280 . doi: 10.1364/oe.18.007269 http://dx.doi.org/10.1364/oe.18.007269

杨楠卓 . 基于光谱反射原理的高深宽比沟槽深度测量技术研究［D］. 长春：长春理工大学， 2020 .

YANG N ZH . Research on Depth Measurement of the High Aspect Ratio Trenches Based on Spectral Reflectometry ［D］. Changchun ： Changchun University of Science and Technology ， 2020 . （in Chinese）

张传维 . 基于模型的微纳深沟槽结构红外反射谱测量方法研究［D］. 武汉：华中科技大学， 2009 .

ZHANG CH W . Research on Method of Model-based Infrared Reflectometry for Micro/nano Deep Trench Structures ［D］. Wuhan ： Huazhong University of Science and Technology ， 2009 . （in Chinese）

高志山，袁群，孙一峰，等 . 微结构显微光学无损检测方法［J］. 光子学报，， 2022 ， 51 （ 8 ）： 17 - 34 . doi: 10.3788/gzxb20225108.0851501 http://dx.doi.org/10.3788/gzxb20225108.0851501

GAO ZH SH ， YUAN Q ， SUN Y F ， et al . Non-destructive test methods of microstructures by optical microscopy ［J］. Acta Photonica Sinica ， 2022 ， 51 （ 8 ）： 17 - 34 . （in Chinese） . doi: 10.3788/gzxb20225108.0851501 http://dx.doi.org/10.3788/gzxb20225108.0851501

马龙 . 白光扫描干涉测量方法与系统的研究［D］. 天津：天津大学， 2011 . doi: 10.3969/j.issn.1672-6030.2011.01.008 http://dx.doi.org/10.3969/j.issn.1672-6030.2011.01.008

MA L . Study on White Light Scanning Interferometry ： Measurement Method and System ［D］. Tianjin ： Tianjin University ， 2011 . （in Chinese） . doi: 10.3969/j.issn.1672-6030.2011.01.008 http://dx.doi.org/10.3969/j.issn.1672-6030.2011.01.008

王玉坤，曹召良，李大禹，等 . 液晶-变形镜自适应光学系统的数据采集与处理软件设计［J］. 光学精密工程， 2018 ， 26 （ 6 ）： 1507 - 1516 . doi: 10.3788/ope.20182606.1507 http://dx.doi.org/10.3788/ope.20182606.1507

WANG Y K ， CAO ZH L ， LI D Y ， et al . Design of liquid crystal-deformable mirror adaptive optical system data acquisition and process software ［J］. Opt. Precision Eng. ， 2018 ， 26 （ 6 ）： 1507 - 1516 . （in Chinese） . doi: 10.3788/ope.20182606.1507 http://dx.doi.org/10.3788/ope.20182606.1507

刘维，徐珺楠，金玳冉，等 . 基于CNN-SPGD算法的相干光通信像差校正方法研究［J］. 光学精密工程， 2022 ， 30 （ 6 ）： 743 - 754 . doi: 10.37188/OPE.20223006.0743 http://dx.doi.org/10.37188/OPE.20223006.0743

LIU W ， XU J N ， JIN D R ， et al . Research on aberration correction method of coherent optical communication based on CNN-SPGD algorithm ［J］. Opt. Precision Eng. ， 2022 ， 30 （ 6 ）： 743 - 754 . （in Chinese） . doi: 10.37188/OPE.20223006.0743 http://dx.doi.org/10.37188/OPE.20223006.0743

HIDDLESTON H R ， LYMAN D D ， SCHAFER E L . Comparisons of deformable-mirror models and influence functions ［C］. San Diego ， ' 91 . Proc SPIE 1542， Active and Adaptive Optical Systems ， DiegoSan ， CA ， USA . 1991， 1542 ： 20 - 33 . doi: 10.1117/12.48791 http://dx.doi.org/10.1117/12.48791

孙一峰，高志山，范筱昕，等 . 低相干干涉高深宽比结构高度检测信号处理技术［J］. 光子学报， 2022 ， 51 （ 9 ）： 331 - 341 . doi: 10.3788/gzxb20225109.0912001 http://dx.doi.org/10.3788/gzxb20225109.0912001

SUN Y F ， GAO ZH SH ， FAN X X ， et al . Signal processing for height measurement of high-aspect-ratio structure based on low-coherence interferometry ［J］. Acta Photonica Sinica ， 2022 ， 51 （ 9 ）： 331 - 341 . （in Chinese） . doi: 10.3788/gzxb20225109.0912001 http://dx.doi.org/10.3788/gzxb20225109.0912001

王昕 . 含噪声图像的多聚焦融合算法［J］. 光学精密工程， 2011 ， 19 （ 12 ）： 2977 - 2984 . doi: 10.3788/ope.20111912.2977 http://dx.doi.org/10.3788/ope.20111912.2977

WANG X . Multi-focus fusion algorithm for noisy images ［J］. Optics and Precision Engineering ， 2011 ， 19 （ 12 ）： 2977 - 2984 . （in Chinese） . doi: 10.3788/ope.20111912.2977 http://dx.doi.org/10.3788/ope.20111912.2977

Views

732

下载量

CSCD

Alert me when the article has been cited

提交

Tools

Publicity Resources

Nondestructive measuring of refractive index of capillary with non-paraxial conditions

Nondestructive measurement of refractive index of transparency capillary

Related Author

LI Qiang

YANG Rui-fen

ZHAI Yin

PU Xiao-yun

LI Qiang

SU Guang-hui

ZHANG Rui-kai

SUN Li-cun

Related Institution

Department of Physics , School of Physical Science and Technology， Yunnan University

Department of Physics, School of Physical Science and Technology, Yunnan University

AI问答

Address：No.3888 Dong Nanhu Road, Changchun, Jilin, China Postal code：130033
Tel：0431-86176855 Email：gxjmgc@ciomp.ac.cn
Technical support is provided by Beijing Founder electronics co., LTD 吉ICP备11002662号-17 京公网安备11010802024621
It is recommended to read the content of this site in Chrome&IE9+. Please switch to extreme mode in browser 360.
Cookies We use cookies to help provide and enhance our service and tailor content. By continuing, you agree to the use of cookies.

⁰