Experimental Investigation of the Ultrasonic Vibration Abrasive Tape Polishing

Wang Xiankui; Zou Baochang

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Experimental Investigation of the Ultrasonic Vibration Abrasive Tape Polishing

更新时间：2020-08-12

- Experimental Investigation of the Ultrasonic Vibration Abrasive Tape Polishing
- Optics and Precision Engineering Vol. 1, Issue 1, Pages: 72-81(1993)
- 作者机构：
  
  清华大学北京,100084
- 作者简介：
- 基金信息：
- DOI：
  CLC：
- Received：14 April 1993，
  
  Published Online：15 February 1993，
  
  Published：15 February 1993
- 稿件说明：
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王先逵, 邹保昌. 超声砂带研抛的实验研究[J]. 光学精密工程, 1993,(1): 72-81

Wang Xiankui, Zou Baochang. Experimental Investigation of the Ultrasonic Vibration Abrasive Tape Polishing[J]. Editorial Office of Optics and Precision Engineering, 1993,(1): 72-81
王先逵, 邹保昌. 超声砂带研抛的实验研究[J]. 光学精密工程, 1993,(1): 72-81 DOI：

Wang Xiankui, Zou Baochang. Experimental Investigation of the Ultrasonic Vibration Abrasive Tape Polishing[J]. Editorial Office of Optics and Precision Engineering, 1993,(1): 72-81 DOI：

摘要

超声砂带研抛是在开式砂带研抛中叠加超声振动而形成的一种复合加工工艺。文中阐述了超声砂带研抛的工作方式、基本原理和系统设计

对砂带振动状态进行了测试和分析

并对比了超声砂带研抛和普通砂带研抛后的工件表面糙度及其加工效率。

Abstract

The ultrasonic vibration abrasive tape polishing is a compound machining method

based on the open-loop abrasive tape polishing add to the ultrasonic vibration. The paper describes the operation mode

basic principle and system design

testing and analyses of the vibration state

compared with the abrasive tape polishing in roughness and efficiency.

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