The Primary Study of Superpolishing of LiGaO2 Single Crystal for a Substrate of GaN Thin Film

Xie Lun; Gao Honggang; Chen Bin; Cao Jianlin; Wang Jianming; Liu Lin

doi:null

您当前的位置：

首页 >

文章列表页 >

The Primary Study of Superpolishing of LiGaO₂ Single Crystal for a Substrate of GaN Thin Film

Article | 更新时间：2020-08-12

- The Primary Study of Superpolishing of LiGaO₂ Single Crystal for a Substrate of GaN Thin Film
- Optics and Precision Engineering Vol. 5, Issue 5, Pages: 57-62(1997)
- 作者机构：
  
  1. 中国科学院长春光学精密机械研究所, 长春, 130022
  2. 中国科学院物理研究所, 北京, 100080
- 作者简介：
- 基金信息：
- DOI：
  CLC：
- Received：10 June 1997，
  
  Published Online：15 October 1997，
  
  Published：15 October 1997
- 稿件说明：
移动端阅览
谢伦, 高宏刚, 陈斌, 曹健林, 王建明, 刘琳. GaN 用衬底材料 LiGaO2 晶体超精密抛光的初步实验[J]. 光学精密工程, 1997,(5): 57-62

Xie Lun, Gao Honggang, Chen Bin, Cao Jianlin, Wang Jianming, Liu Lin. The Primary Study of Superpolishing of LiGaO2 Single Crystal for a Substrate of GaN Thin Film[J]. Editorial Office of Optics and Precision Engineering, 1997,(5): 57-62
谢伦, 高宏刚, 陈斌, 曹健林, 王建明, 刘琳. GaN 用衬底材料 LiGaO2 晶体超精密抛光的初步实验[J]. 光学精密工程, 1997,(5): 57-62 DOI：

Xie Lun, Gao Honggang, Chen Bin, Cao Jianlin, Wang Jianming, Liu Lin. The Primary Study of Superpolishing of LiGaO2 Single Crystal for a Substrate of GaN Thin Film[J]. Editorial Office of Optics and Precision Engineering, 1997,(5): 57-62 DOI：

摘要

主要介绍了作为发光半导体GaN衬底材料的LiGaO

单晶超精密抛光方法及初步结果。利用聚氨酯抛光盘配合SiO

悬浮液

采用机械化学抛光方法

已加工出表面粗糙度优于0.1mm

的超光滑表面。

Abstract

This paper represents a method and primary experimental results of superpolishing of LiGaO

signle crystal as a substrate for GaN.We have achieved supersmooth surface roughness of less than 0.1nm by the chemo mechanical polishing with polyurethane lap and SiO

solution.

关键词

Keywords

references

Views

735

下载量

CSCD

Alert me when the article has been cited

提交

Tools

Publicity Resources

Modification of nickel slag and application in magnetic compound fluid polishing

Modeling of removal function and optimization of process parameters for robotic polishing M-ZnS

Process development of small size copper-plated InP wafer with 8-inch CMP equipment

Influence of water in magnetic compound fluid on polishing performance

Optimization of process parameters and surface characteristics in laser-assisted ultra-precision cutting of monocrystalline silicon

Related Author

WANG Youliang

YU Puyao

YIN Xincheng

ZHANG Wenjuan

ZANG Yikai

ZHU Beibei

QIN Lin

SHANG Yao

Related Institution

State Key Laboratory of Advanced Processing and Recycling of Nonferrous Metals， Lanzhou University of Technology

School of Mechanical and Electronical Engineering， Lanzhou University of Technology

Key Laboratory of Digital Manufacturing Technology and Application， Ministry of Education of China， Lanzhou University of Technology

School of Mechanical Science and Engineering， Huazhong University of Science and Technology

Shanghai Aerospace Control Technology Research Institute

AI问答

Address：No.3888 Dong Nanhu Road, Changchun, Jilin, China Postal code：130033
Tel：0431-86176855 Email：gxjmgc@ciomp.ac.cn
Technical support is provided by Beijing Founder electronics co., LTD 吉ICP备11002662号-17 京公网安备11010802024621
It is recommended to read the content of this site in Chrome&IE9+. Please switch to extreme mode in browser 360.
Cookies We use cookies to help provide and enhance our service and tailor content. By continuing, you agree to the use of cookies.

⁰