Mounting Membrane Combined IC with Reflow Soldering Technology

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- Mounting Membrane Combined IC with Reflow Soldering Technology
- Optics and Precision Engineering Vol. 5, Issue 5, Pages: 94-97(1997)
- 作者机构：
  
  中国科学院长春光学精密机械研究所长春,130022
- 作者简介：
- 基金信息：
- DOI：
  CLC：
- Received：31 January 1997，
  
  Published Online：15 October 1997，
  
  Published：15 October 1997
- 稿件说明：
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李德志. 用再流焊技术组装薄膜混合集成电路[J]. 光学精密工程, 1997,(5): 94-97

Li Dezhi. Mounting Membrane Combined IC with Reflow Soldering Technology[J]. Editorial Office of Optics and Precision Engineering, 1997,(5): 94-97
李德志. 用再流焊技术组装薄膜混合集成电路[J]. 光学精密工程, 1997,(5): 94-97 DOI：

Li Dezhi. Mounting Membrane Combined IC with Reflow Soldering Technology[J]. Editorial Office of Optics and Precision Engineering, 1997,(5): 94-97 DOI：

主要介绍了运用再流焊技术组装薄膜混合集成电路的工艺过程

以及在焊接中出现的问题和解决的方法。

In this paper

it principally presents the technological course of mounting membrane combined IC(Integrated Circuit) using reflow soldering technology

as well as the problem appearing in the soldering and the solving-method.

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