Simulation of Even Material Removal During Eccentric Plane Polishing by a Tin Polisher

ZHANG Hong-Xia; GAO Hong-Gang; WU Ming-Gen

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Simulation of Even Material Removal During Eccentric Plane Polishing by a Tin Polisher

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- Simulation of Even Material Removal During Eccentric Plane Polishing by a Tin Polisher
- Optics and Precision Engineering Vol. 6, Issue 2, Pages: 77-82(1998)
- 作者机构：
  
  1. 中国科学院长春光学精密机械研究所应用光学国家重点实验室长春,130022
  2. 北京超精密加工技术国防科技重点实验室北京,100076
- 作者简介：
- 基金信息：
- DOI：
  CLC：
- Received：30 December 1997，
  
  Revised：15 January 1998，
  
  Published Online：15 April 1998，
  
  Published：15 April 1998
- 稿件说明：
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张红霞, 高宏刚, 吴明根. 定偏心锡磨盘超精密平面抛光均匀去除模拟计算(Ⅰ)[J]. 光学精密工程, 1998,(2): 77-82

ZHANG Hong-Xia, GAO Hong-Gang, WU Ming-Gen . Simulation of Even Material Removal During Eccentric Plane Polishing by a Tin Polisher[J]. Editorial Office of Optics and Precision Engineering, 1998,(2): 77-82
张红霞, 高宏刚, 吴明根. 定偏心锡磨盘超精密平面抛光均匀去除模拟计算(Ⅰ)[J]. 光学精密工程, 1998,(2): 77-82 DOI：

ZHANG Hong-Xia, GAO Hong-Gang, WU Ming-Gen . Simulation of Even Material Removal During Eccentric Plane Polishing by a Tin Polisher[J]. Editorial Office of Optics and Precision Engineering, 1998,(2): 77-82 DOI：

摘要

定偏心平面抛光中

工件表面各区域材料的均匀去除问题涉及工件加工后的面形。本文从理论上讨论了锡磨盘与工件的转速比、偏心距及转速对工件表面面形的影响

以及工件边缘露出磨盘的情况下

表面的不均匀去除程度。模拟计算结果表明当转速比为1

工件不露出磨盘时

可以实现工件材料的均匀去除。

Abstract

The even material removal in the contacting area between the surfaces of polisher and the samples being finished is important for the surface contour of the samples after polishing. This paper analyzes the differences of material removal of different positions on the sample surfaces theoretically as a function of rotating ratio of sample holder and main spindle

eccentric distance and rotating velocity. The edge effect when part of the sample surfaces do not keep in contact with the polisher continuously is discussed. The simulation shows that even material removal can be achieved while the rotating ratio is 1

and every position of sample surfaces keep touching the polisher during polishing.

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