Research on the design of a fully automatic gold wire bonder with CAD/CAE

WANG Yan-Feng; HE Hui-Yang; SUN Bao-yu; SONG Wen-rong; LIU Yan-bin

doi:null

您当前的位置：

首页 >

文章列表页 >

Research on the design of a fully automatic gold wire bonder with CAD/CAE

更新时间：2020-08-12

- Research on the design of a fully automatic gold wire bonder with CAD/CAE
- Optics and Precision Engineering Vol. 10, Issue 5, Pages: 466-470(2002)
- 作者机构：
  
  中国科学院长春光学精密机械与物理研究所, 吉林, 长春, 130022
- 作者简介：
- 基金信息：
- DOI：
  CLC： TP391.72
- Received：17 March 2002，
  
  Revised：23 August 2002，
  
  Published Online：15 October 2002，
  
  Published：15 October 2002
- 稿件说明：
移动端阅览
王延风, 何惠阳, 孙宝玉, 宋文荣, 刘延斌. 全自动金丝球焊机的CAD/CAE设计研究[J]. 光学精密工程, 2002,(5): 466-470

WANG Yan-feng, He Hui-yang, SUN Bao-yu, SONG Wen-rong, LIU Yan-bin. Research on the design of a fully automatic gold wire bonder with CAD/CAE[J]. Editorial Office of Optics and Precision Engineering, 2002,(5): 466-470
王延风, 何惠阳, 孙宝玉, 宋文荣, 刘延斌. 全自动金丝球焊机的CAD/CAE设计研究[J]. 光学精密工程, 2002,(5): 466-470 DOI：

WANG Yan-feng, He Hui-yang, SUN Bao-yu, SONG Wen-rong, LIU Yan-bin. Research on the design of a fully automatic gold wire bonder with CAD/CAE[J]. Editorial Office of Optics and Precision Engineering, 2002,(5): 466-470 DOI：

摘要

全自动金丝球焊机是微电子封装设备中的核心设备

它是集精密机械、自动控制、图像识别、计算机应用、光学、超声波焊接等多领域技术于一体的现代高技术微电子生产设备.工作原理是通过X-Y工作台和焊头的三维运动控制

定位并拉出设定的金丝线型

采用超声波热压球焊方法焊接芯片管脚.技术路线是应用光机电一体化技术和采用CAD/CAE技术手段进行研制与开发.超声球焊和高速高精度运动定位技术是关键技术.为使球焊机达到高速高精度焊接的要求

应用CAD/CAE技术对球焊机关键部件X-Y工作台及焊头进行CAD建模的概念设计、有限元力学分析和结构优化设计.

Abstract

Fully automatic gold wire bonder is the key device of the package equipment for micro-electrons

which is associated with integrating technologies of fine mechanics

automatic control

image recognition

computer application

optics and ultrasonic wave bond. By controling three-dimensional motion of the X-Y table and bond head

precision positioning and desired line-type gold wires can be realized

and an ultrasonic wave bonded method is used. The technology route is to use integrating technologies of optics and mechatronics as well as CAD/CAE to develop new products. Ultrasonic wave bond and precision position at high speed are key technologies. By means of CAD/CAE technology

The solid models of the X-Y table and bond head assembly were built

and based on the solid models

the mechanism simulation was done. By using finite element method(FEM)

the structural analysis will be done for improving design to meet the demand of bonding precision and speed.

关键词

Keywords

references

刘恒,虞烈,谢有柏.现代设计方法与新产品开发[J] . 中国机械工程,1999,10(1):81-83.

褚学宁.虚拟企业产品设计技术研究[J] .中国机械工程,1999,10(1):58-60.

庄晓,周雄辉,许文斌,等.虚拟环境中的快速产品装配建模[J] .中国机械工程,1999,10(2): 185-187.

卢锷,杨洪波,王延风,等.产品研制开发CAD/CAE/CAM技术路线与应用[J] .光学精密工程,1997,5(6):1-9.

王延风.多联动机构运动仿真[J] . 光学精密工程,1997,5(6):21-24.

罗小川,车仁生,崔长彩.分布式网络化测量[J] .光学精密工程,2002,10(1):1-7.

王延风.机构运动仿真在光机电工程中的应用[J] .光学精密工程.1996,4(6):13-16.

单宝忠,武克用,卢锷.结合有限元法的空间相机优化设计[J] .光学精密工程.2002,10(1): 116-120.

Aanantha R,Krammer G,Crawfordt R H. Assembly modeling by geometric constraint satisfaction[J] . Computer aided design,1996,28(9):707-722.

刘品宽,孙立宁,曲东升,等.新型二维纳米级微动工作台的动力学分析[J] . 光学精密工程.2002,10(2): 142-147.

吴鹰飞,李勇,周兆英,等. 蠕动式X-Y-θ微动工作台的设计实现[J] . 中国机械工程. 2001,12(3):263-265.

Views

770

下载量

CSCD

Alert me when the article has been cited

提交

Tools

Publicity Resources

Mechanism Analysis and Simulation for Transfer Film Photograph Systems on Space Camera

Related Author

No data

Related Institution

Changchun Institute of Optics and Fine Mechanics, Chinese Academy of Sciences, Changchun 130022

AI问答

Address：No.3888 Dong Nanhu Road, Changchun, Jilin, China Postal code：130033
Tel：0431-86176855 Email：gxjmgc@ciomp.ac.cn
Technical support is provided by Beijing Founder electronics co., LTD 吉ICP备11002662号-17 京公网安备11010802024621
It is recommended to read the content of this site in Chrome&IE9+. Please switch to extreme mode in browser 360.
Cookies We use cookies to help provide and enhance our service and tailor content. By continuing, you agree to the use of cookies.

⁰