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1. Department of Intelligent Machines and System Engineering, Hirosaki University, 3 Bunkyo_cho, Hirosaki 036-8561, Japan
2. Tohoku University, 2_1_1 Katahira, Aoba_ku, Sendai 980_,Japan,8577
3. Department of Mechanical Engineering, Tohoku University, 01 Aoba, Aramaki, Aoba_ku, Sendai 980_,Japan,8579
Received:15 January 2003,
Revised:05 March 2003,
Published Online:15 April 2003,
Published:15 April 2003
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Kazuhiko Sasagawa, Masataka Hasegawa, Masumi Saka, Hiroyuki Ab?. Prediction of electromigration failure in passivated polycrystalline line[J]. 光学精密工程, 2003,(2): 114-119
Kazuhiko Sasagawa, Masataka Hasegawa, Masumi Saka, Hiroyuki Abé. Prediction of electromigration failure in passivated polycrystalline line[J]. Editorial Office of Optics and Precision Engineering, 2003,(2): 114-119
Kazuhiko Sasagawa, Masataka Hasegawa, Masumi Saka, Hiroyuki Ab?. Prediction of electromigration failure in passivated polycrystalline line[J]. 光学精密工程, 2003,(2): 114-119 DOI:
Kazuhiko Sasagawa, Masataka Hasegawa, Masumi Saka, Hiroyuki Abé. Prediction of electromigration failure in passivated polycrystalline line[J]. Editorial Office of Optics and Precision Engineering, 2003,(2): 114-119 DOI:
Recently
a governing parameter for electromigration damage in passivated polycrystalline lines
AFD
gen
*
was formulated considering the effect of the atomic density gradient. In this study
a prediction method for electromigration failure in a passivated polycrystalline line was proposed using AFD
gen
*
. The characteristics of film used for prediction is established in advance using a method based on AFD
gen
*
. The film characteristics of metal lines with different lengths were determined experimentally by AFD
gen
*
-based method. From the film characteristics obtained
both lifetime and location of failure in the passivated polycrystalline lines were predicted through numerical simulation of failure process. Good agreement has been shown between the predicted and the experimental results concerning both lifetime and location of failure.
Recently
a governing parameter for electromigration damage in passivated polycrystalline lines
AFD
gen
*
was formulated considering the effect of the atomic density gradient. In this study
a prediction method for electromigration failure in a passivated polycrystalline line was proposed using AFD
gen
*
. The characteristics of film used for prediction is established in advance using a method based on AFD
gen
*
. The film characteristics of metal lines with different lengths were determined experimentally by AFD
gen
*
-based method. From the film characteristics obtained
both lifetime and location of failure in the passivated polycrystalline lines were predicted through numerical simulation of failure process. Good agreement has been shown between the predicted and the experimental results concerning both lifetime and location of failure.
SASAGAWA K, NAKAMURA N, SAKA M,et al.Trans ASME J Elect Pack, 1998,120:360.
SASAGAWA K, NAITO K, HASEGAWA M,et al. Advances in Electronic Packaging. 1999,ASME, EEP-26-1, 227 (1999).
SASAGAWA K, NAITO K, SAKA M,et al. J Appl Phys,1999, 86, 6043.
SASAGAWA K, HASEGAWA M, NAITO K,et al. Thin Solid Films, 2001,401:255.
SASAGAWA K, HASEGAWA M, SAKA M,et al. J Appl Phys,2002,91:1882.
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