Experimental and theoretical study on laser cleaning Al<SUB>2</SUB>O<SUB>3</SUB> particle on silicon wafer surface

WU Dong-jiang; XU Yuan; WANG Xu-yue; KANG Ren-ke; SIMA Yuan; HU Li-zhong

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Experimental and theoretical study on laser cleaning Al₂O₃ particle on silicon wafer surface

更新时间：2020-08-12

- Experimental and theoretical study on laser cleaning Al₂O₃ particle on silicon wafer surface
- Optics and Precision Engineering Vol. 14, Issue 5, Pages: 764-770(2006)
- 作者机构：
  
  1. 大连理工大学精密与特种加工教育部重点实验室,辽宁大连 116024
  2. 大连理工大学三束材料改性国家重点实验室,辽宁大连,116024
- 作者简介：
- 基金信息：
- DOI：
  CLC： TN249
- Received：18 January 2006，
  
  Revised：13 June 2006，
  
  Published Online：30 October 2006，
  
  Published：30 October 2006
- 稿件说明：
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WU Dong-jiang, XU Yuan, WANG Xu-yue, et al. Experimental and theoretical study on laser cleaning Al₂O₃ particle on silicon wafer surface[J]. Optics and precision engineering, 2006, 14(5): 764-770.
DOI：

WU Dong-jiang, XU Yuan, WANG Xu-yue, et al. Experimental and theoretical study on laser cleaning Al₂O₃ particle on silicon wafer surface[J]. Optics and precision engineering, 2006, 14(5): 764-770. DOI：

摘要

以KrF准分子激光器为激光源

对目前工业上常用的硅片研磨抛光液的主要成分Al

颗粒进行激光清洗的试验和理论分析。建立一维热传导模型

利用有限元分析软件MSC.MarC模拟硅片表面的温度随激光作用时间和能量密度的分布。通过理论计算

量化了颗粒所受到的清洗力以及其与硅片表面之间的粘附力

理论预测出1 μm Al

颗粒的激光清洗阈值为60 mJ/cm

。在理论分析的指导下

利用248 nm、30 ns的KrF准分子激光进行单因素试验

研究激光能量密度、脉冲个数、激光束入射角度对激光干法清洗效率的影响

并且实验验证了清洗模型以及场增强效应对激光清洗结果的影响。

Abstract

The laser cleaning of Al

particles which are the main component of the silicon wafer lap-polishing solution commonly used in industry nowadays was studied by experiments combined with theoretical analysis. The simple heat-conduction model was built and the temperature field on silicon wafer surface during laser cleaning was simulated using the finite element method. The adhesion force between the particle and the substrate and cleaning force acting on the particles were calculated

and the theoretical threshold of laser cleaning 1 μm Al

is 60mJ·cm

-2

. Under the guidance of the mechanism analysis

a serial of laser dry cleaning experiments were carried out to study the dependence of laser cleaning efficiency on laser fluence

numbers of pulse

and laser beam incidence angle on silicon wafer surface using 248 nm

30 ns

KrF excimer laser

Which confirmed the clean model as well as the effect of the field enhancement on laser cleaning.

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Related Author

WANG Xu-yue

XU Wei-xing

SI Ma-yuan

WU Dong-jing

KANG Ren-ke

GUO Dong-ming

Ke-jun XU

Xiao-jing YUAN

Related Institution

Key Laboratory for Precision and Non-traditional Machining Technology of the Ministry of Education, Dalian University of Technology

Rocket Force University of Engineering

National Defense Key Laboratory for Remanufacturing Technology， Academy of Army Armored Forces

School of Mechanical Engineering， Jiangsu University

Nanjing Institute of Advanced Laser Technology

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Experimental and theoretical study on laser cleaning Al2O3 particle on silicon wafer surface

DOI：

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Abstract

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Experimental and theoretical study on laser cleaning Al₂O₃ particle on silicon wafer surface