Experimental study of bending silicon chip with

long pulse width laser WU Dong-jiang; MA Guang-yi; ZHOU Qiu-ju; XU Wei-xing; XU Yuan; WAN

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Experimental study of bending silicon chip with

Article | 更新时间：2020-08-12

- Experimental study of bending silicon chip with
- Optics and Precision Engineering Vol. 15, Issue 9, Pages: 1361-1365(2007)
- 作者机构：
  
  1. 大连理工大学精密与特种加工教育部重点实验室,辽宁大连,116023
  2. 大连理工大学三束材料改性国家重点实验室,辽宁大连,116024
- 作者简介：
- 基金信息：
- DOI：
  CLC： TN249
- Received：21 January 2007，
  
  Revised：31 May 2007，
  
  Published Online：30 September 2007，
  
  Published：30 September 2007
- 稿件说明：
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吴东江,马广义,周秋菊,许卫星,许媛,王续跃,赵福令. 长脉宽脉冲激光硅片弯曲成形试验[J]. 光学精密工程, 2007,15(9):1361-1365

long pulse width laser WU Dong-jiang, MA Guang-yi, ZHOU Qiu-ju, et al. Experimental study of bending silicon chip with[J]. Optics and precision engineering, 2007, 15(9): 1361-1365.
吴东江,马广义,周秋菊,许卫星,许媛,王续跃,赵福令. 长脉宽脉冲激光硅片弯曲成形试验[J]. 光学精密工程, 2007,15(9):1361-1365 DOI：

long pulse width laser WU Dong-jiang, MA Guang-yi, ZHOU Qiu-ju, et al. Experimental study of bending silicon chip with[J]. Optics and precision engineering, 2007, 15(9): 1361-1365. DOI：

摘要

利用毫秒脉宽Nd:YAG激光对硅片进行了弯曲试验

给出了长脉宽脉冲激光弯曲硅片的能量阈值条件。研究了长脉宽Nd:YAG激光脉冲频率和脉冲宽度参数对硅片弯曲角度的影响

同时说明了脉冲频率和脉冲宽度参数对弯曲角度的影响可以转换成扫描速度和功率密度对弯曲角度的影响

并对试验结果进行了分析

引入了脉冲占空比来表征能量的时域分布对弯曲现象的影响。试验结果表明

采用毫秒量级脉冲激光可以对硅片进行弯曲加工

弯曲角度可达20°以上。

Abstract

The experiment of silicon chip bending by a millisecond pulse width Nd:YAG laser was done

and the energy threshold of silicon bending was given. Meanwhile

using the Nd:YAG long pulse laser

the influence of pulse frequency and pulse width on the bending angle was mainly investigated

which could be transformed to the influence of scan velocity and power intensity on the bending angle. The pulse duty cycle was also used to describe the influence of the energy’s time distribution on bending. The experimental results indicate that the silicon chip could be bent an angle more than 20° using the Nd:YAG long pulse laser.

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Related Institution

大连理工大学机械工程学院2. 大连理工大学

大连理工大学机械工程学院

Key Laboratory for Precision and Non-traditional Machining Technology, Ministry of Education, Dalian University of Technology

Changchun Institute of Optics, Fine Mechanics and Physics, Chinese Academy of Sciences

Graduate School of the Chinese Academy of Sciences

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