Finite element simulation on packaging of hinged high-g micromachined accelerometer
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Finite element simulation on packaging of hinged high-g micromachined accelerometer
Optics and Precision EngineeringVol. 15, Issue 2, Pages: 199-205(2007)
作者机构:
1. 中国科学院 上海微系统与信息技术研究所 传感技术国家重点实验室 上海,200050
2. 浙江大学 机械与能源工程学院,浙江 杭州,310027
作者简介:
基金信息:
DOI:
CLC:TP212.17
Received:27 October 2006,
Revised:12 December 2006,
Published Online:20 February 2007,
Published:20 February 2007
稿件说明:
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CHE Lu-feng, LU Yun, XU Zhi-nong. Finite element simulation on packaging of hinged high-g micromachined accelerometer[J]. Optics and precision engineering, 2007, 15(2): 199-205.
DOI:
CHE Lu-feng, LU Yun, XU Zhi-nong. Finite element simulation on packaging of hinged high-g micromachined accelerometer[J]. Optics and precision engineering, 2007, 15(2): 199-205.DOI:
Finite element simulation on packaging of hinged high-g micromachined accelerometer
A novel packaged hinged high-g micromachined accelerometer was studied by finite element simulations. The mode shape of high-g accelerometer without packaging were analyzed
and then the first ten natural frequency characteristics of packaging structure without and with different potting materials were discussed. Experimental results conclude that the elastic modulus of potting material has a significant influence on the mode shape of the accelerometer packaged. The mode frequency of the packaging structure increases with the elastic modulus of potting material
but the small elastic modulus (
E
≤1 GPa) will bring a strong distortion of the accelerometer output. The simulation results also show that the potting material with enough large elastic modulus(
E
>
9 GPa) should be optimal selection for high-g accelerometer.
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references
. 刘危,解旭辉,李圣怡. 微机械惯性传感器的技术现状及展望[J]. 光学 精密工程,2003,10(5):425-431. LIU W,XIE X H,LI SH Y. Present state and perspectives of micromachined inertial sensors[J]. Opt. Precision Eng.,2003,10(5):425-431. (in Chinese)
. XUE W,WANG J,CUI T H. Highly sensitive micromachined tunneling sensors[J]. Opt. Precision Eng.,2004,10(5):491-503.
. 张燕君,陈才和,吴波,等. 硅微光机械加速度地震检波器中M-Z光波导干涉仪结构设计[J]. 光学 精密工程,2006,13(1):77-82. ZHANG Y J,CHEN C H,WU B,et al.. Structure design of M-Z interferometer in electrooptic integrated acceleration seismic geophone[J]. Opt. Precision Eng.,2006,13(1):77-82.(in Chinese)
. TANNER D M, WALRAVEN J A, HELGESEN K, et al.. MEMS reliability in shock environments . IEEE International Reliability Physics Symposium,2000, Piscataway: 129-138.
. DAVIES B R, BARRON C C, MONTAGUE S, et al.. High g MEMS integrated accelerometer[J]. SPIE, 1997, 3046: 52-62.
. 黄卫东,彩霞,徐步陆,等. 封装对MEMS高g值传感器性能的影响[J]. 功能材料与器件学报,2002,8(3):251-258. HUANG W D, CAI X, XU B L, et al.. Packaging effects on the performance of an accelerometer used in high-g environments[J]. J. Funct. Mater. Devic., 2002, 8(3):251-258.(in Chinese)
. HUANG W D,CAI X,XU B L, et al.. Packaging effects on the performance of MEMS for high-g accelerometer with double-cantilevers[J]. Sensor Actuator A, 2003,102 (3): 268-278.
. 蒋玉齐,杜茂华,罗乐. 灌封对高量程微机械加速度计封装的影响[J]. 机械强度,2004,26(2):149-153. JIANG Y Q,DU M H,LUO L. Effect of potting on the packaging of high-g MEMS accelerometer [J]. J. Mech. Strength,2004,26(2):149-153.(in Chinese)
. WALTER P L. Trends in accelerometer design for military and aerospace application [J]. Sensors Magazine,1999,16(3):21-25.