Study on the Phase Transformations of the Ground Monocrystalline Silicon Wafers Surfaces

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Study on the Phase Transformations of the Ground Monocrystalline Silicon Wafers Surfaces

Article | 更新时间：2020-08-12

- Study on the Phase Transformations of the Ground Monocrystalline Silicon Wafers Surfaces
- Optics and Precision Engineering Vol. 16, Issue 8, Pages: 1440-1445(2008)
- 作者机构：
  
  郑州大学机械工程学院
- 作者简介：
- 基金信息：
- DOI：
  CLC： TG580.1;TN305.1
- Received：07 January 2008，
  
  Revised：28 March 2008，
  
  Published Online：25 August 2008，
  
  Published：25 August 2008
- 稿件说明：
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张银霞,郜伟,康仁科,郭东明. 单晶硅片磨削表面相变研究[J]. 光学精密工程, 2008,16(8):1440-1445

Study on the Phase Transformations of the Ground Monocrystalline Silicon Wafers Surfaces[J]. Optics and precision engineering, 2008, 16(8): 1440-1445.
张银霞,郜伟,康仁科,郭东明. 单晶硅片磨削表面相变研究[J]. 光学精密工程, 2008,16(8):1440-1445 DOI：

Study on the Phase Transformations of the Ground Monocrystalline Silicon Wafers Surfaces[J]. Optics and precision engineering, 2008, 16(8): 1440-1445. DOI：

摘要

为了揭示硅片自旋转磨削加工过程中材料的去除机理，采用显微拉曼光谱仪研究了硅片磨削表面的相变。结果表明：半精磨和精磨硅片表面存在-Si相、Si-III相、Si-IV相和Si-XII相，这表明磨削过程中Si-I相发生了高压金属相变（Si-II相），Si-II相容易以塑性方式去除。粗磨硅片表面没有明显的多晶硅，只有少量的非晶硅出现，材料以脆性断裂方式去除。从粗磨到精磨，材料去除方式由脆性断裂去除向塑性去除过渡。粗磨向半精磨过渡时，相变强度越大，材料的塑性去除程度越大；半精磨向精磨过渡时，相变强度越小，材料的塑性去除程度越大。

Abstract

In order to understand the material removal mechanism during wafer rotation grinding

this study investigates the phase transformations on the ground silicon wafer surface with the aid of Raman microspectroscopy. The results show that，the amorphous silicon (-Si )

Si-III phase

Si-IV phase and Si-XII phase existing on the semi-fine and fine ground wafer surface indicate that the Si-I phase is transformed to ductile metal phase (Si-II phase) during grinding. The Si-II phase is ductile and easily removed by ductile mode. There is no obvious polycrystalline silicon on the rough ground wafer surface. Only very small amount -Si is observed. The material was removed by brittle mode. From rough grinding to fine grinding

the material removal mode changes from micro-fracture mode to ductile mode gradually. During the transition from rough grinding to semi-fine grinding

with the increasing of the phase transformation degree

the ductile mode removal degree increases. During the transition from semi-fine grinding to fine grinding

the ductile mode removal degree increases as the phase transformation degree decreases.

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