Thermal Design and Proof Test of CCD Component  in Spectral Imaging Apparatus

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Thermal Design and Proof Test of CCD Component in Spectral Imaging Apparatus

Article | 更新时间：2020-08-12

- Thermal Design and Proof Test of CCD Component in Spectral Imaging Apparatus
- Optics and Precision Engineering Vol. 17, Issue 10, Pages: 2440-2444(2009)
- 作者机构：
  
  中国科学院长春光学精密机械与物理研究所,吉林长春,130033
- 作者简介：
- 基金信息：
- DOI：
  CLC：
- Received：04 November 2008，
  
  Revised：12 December 2008，
  
  Published Online：20 October 2009，
  
  Published：20 October 2009
- 稿件说明：
移动端阅览
许杰,郭亮. 光谱成像仪CCD组件热分析及验证[J]. 光学精密工程, 2009,17(10):2440-2444

Thermal Design and Proof Test of CCD Component in Spectral Imaging Apparatus[J]. Optics and precision engineering, 2009, 17(10): 2440-2444.
许杰,郭亮. 光谱成像仪CCD组件热分析及验证[J]. 光学精密工程, 2009,17(10):2440-2444 DOI：

Thermal Design and Proof Test of CCD Component in Spectral Imaging Apparatus[J]. Optics and precision engineering, 2009, 17(10): 2440-2444. DOI：

摘要

某型光谱成像仪是一台集多光学通道和多探测器于一身的复杂的空间光学遥感器，其光机结构、安装方式和载荷分布均呈非对称形式，整机热控十分复杂。CCD组件作为成像的重要组成部分，同时也是整机热控的难点，其热设计的好坏直接关系到成像的质量。本文着重讨论分析了某型光谱成像仪CCD组件热设计的特点，给出了相应的热设计方案，应用IDEAS-TMG对此组件进行了仿真分析，达到了热控设计的指标要求，最后通过试验对热设计方案进行了验证。

Abstract

As a complex space optical remote sensor with multiple optical channel and detectors

the optical-mechanical structure and the mounting mode and the load distribution in the spectral imaging apparatus present a asymmetric form. It’s very complex and difficult to practice heat control in the spectral imaging apparatus. CCD component is important element of image-forming system

furthermore

it’s a difficult point at the same time. The degree of thermal design have a direct reference of imaging quality. The characteristics of CCD component heat control in the spectral imaging apparatus are discussed and analysed. The corresponding thermal design scheme of CCD component is introduced and this component is simulated by means of software IDEAS-TMG. The guide line of thermal control is achieved. At last

the thermal design scheme is verified by proof heat test.

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Related Institution

Graduate University of Chinese Academy of Sciences

Changchun Institute of Optics, Fine Mechanics and Physics, Chinese Academy of Sciences

Graduate University of Chinese Academy of Sciences, Beijing 100039, China

Changchun Institute of Optics, Fine Mechanics and Physics, Chinese Academy of Sciences, Changchun 130033, China

University of Chinese Academy of Sciences

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