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Micro integrated pressure, temperature, and relative humidity sensor using adhesive bonding with SU-8
Article | 更新时间:2020-08-12
    • Micro integrated pressure, temperature, and relative humidity sensor using adhesive bonding with SU-8

    • Optics and Precision Engineering   Vol. 17, Issue 6, Pages: 1350-1354(2009)
    • CLC: TP212.6
    • Received:20 January 2009

      Revised:30 April 2009

      Published Online:20 June 2009

      Published:20 June 2009

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  • ZHANG Jian-gang, PANG Cheng, FANG Zhen, et al. Micro integrated pressure, temperature, and relative humidity sensor using adhesive bonding with SU-8[J]. Optics and precision engineering, 2009, 17(6): 1350-1354. DOI:

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Related Author

XIAO Su-yan
CHE Lu-feng
WANG Yue-lin
LI Xin-xin
ZHENG Gaofeng
JIANG Jiaxin
ZHONG Yisheng
KANG Guoyi

Related Institution

State Key Laboratory of Transducer Technology, Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences
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Department of Instrumental and Electrical Engineering, Xiamen University
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Instrumentation Technology and Economy Institute
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