Study on device level vacuum packaging technologies of silicon microgyroscopes

doi:null

您当前的位置：

首页 >

文章列表页 >

Study on device level vacuum packaging technologies of silicon microgyroscopes

Article | 更新时间：2020-08-12

- Study on device level vacuum packaging technologies of silicon microgyroscopes
- Optics and Precision Engineering Vol. 17, Issue 8, Pages: 1987-1992(2009)
- 作者机构：
  
  南京理工大学机械工程学院2. 南京理工大学
- 作者简介：
- 基金信息：
- DOI：
  CLC： TB7;TH824+.3
- Received：08 December 2008，
  
  Revised：19 March 2009，
  
  Published Online：20 August 2009，
  
  Published：20 August 2009
- 稿件说明：
移动端阅览
施芹,苏岩,裘安萍,朱欣华. 硅微陀螺仪器件级真空封装技术研究[J]. 光学精密工程, 2009,17(8):1987-1992

Study on device level vacuum packaging technologies of silicon microgyroscopes[J]. Optics and precision engineering, 2009, 17(8): 1987-1992.
施芹,苏岩,裘安萍,朱欣华. 硅微陀螺仪器件级真空封装技术研究[J]. 光学精密工程, 2009,17(8):1987-1992 DOI：

Study on device level vacuum packaging technologies of silicon microgyroscopes[J]. Optics and precision engineering, 2009, 17(8): 1987-1992. DOI：

摘要

为进一步提高硅微陀螺仪的品质因数及其稳定性，研究了硅微陀螺仪器件级真空封装的高真空获取技术和真空保持技术。首先，以硅微陀螺仪动力学方程为基础，分析了硅微陀螺仪的误差信号与品质因数之间的关系，并采用稀薄气体动力学分析具有高品质因数陀螺仪的空气阻尼。根据早期真空封装陀螺仪的品质因数跟踪测试曲线，分析了品质因数下降原因。采用程序升温脱附职谱分析法（TPD-MS）分析陶瓷管壳和金属盖板的放气特性，并选用了合理的吸气剂。最后，改进了器件级真空封装流程。测试结果表明，采用改进的器件级真空封装的陀螺仪品质因数最高可达162660，约为早期真空封装陀螺仪品质因数的14倍，且在一年内的变化小于0.05%。

Abstract

The high vacuum level and vacuum maintenance of device-level Vacuum packaging for silicon microgyroscopes are studied in order to increase the quality factor and its stability. First

the relationship between error signals and quality factor is analysed based on the dynamics equations of silicon microgyroscopes. The air damping of gyroscopes with high quality factor is analysed using rarefied gas dynamics theory. According the early continual test results of quality factor of vacuum packaged gyroscope

the reasons of vacuum level degrade are given. Temperature programmed desorption-mass spectrometry (TPD-MS) is used to measure the contents of the evolution gases for the ceramic packages and the lid. According to the contents of trapped gases

the reasonable getter is chosen to absorb the gases and keep the vacuum level of the cavity. Finally

the device-level vacuum packaging process is improved. The test results show that the quality factor of gyroscope packaged with new device-level vacuum packaging process is about 162660

which is about fourteen times of quality factor of previous vacuum packaged silicon microgyroscopes

and the change of quality factor is less than 0.05% within one year.

关键词

Keywords

references

Views

234

下载量

CSCD

Alert me when the article has been cited

提交

Tools

Publicity Resources

Implementation and measurement of a miniaturized silicon resonant accelerometer

Quality factor measurement of vacuum-packaged microgyroscopes

Fabrication and wafer-level vacuum packaging of MEMS resonant pressure sensor

Design and experiment of micro-machined vibratory gyroscope

Related Author

Qin SHI

Guo-ming XIA

An-ping QIU

Zhi-qiang WU

Yan SU

Jian ZHAO

WANG Yu-zhao

YU Cai-jia

Related Institution

MEMS Inertial Technology Research Center, Nanjing University of Sci. & Tech.

Xi'an Flight Automatic Control Research Institute, Aviation Industry Corporation of China

State Key Laboratory of Transducer Technology, Institute of Electronics, Chinese Academy of Sciences

MEMS Inertial Technology Research Center, Nanjing University of Science and Technology2. School of Mechanical Engineering, Nanjing University of Science and Technology

AI问答

Address：No.3888 Dong Nanhu Road, Changchun, Jilin, China Postal code：130033
Tel：0431-86176855 Email：gxjmgc@ciomp.ac.cn
Technical support is provided by Beijing Founder electronics co., LTD 吉ICP备11002662号-17 京公网安备11010802024621
It is recommended to read the content of this site in Chrome&IE9+. Please switch to extreme mode in browser 360.
Cookies We use cookies to help provide and enhance our service and tailor content. By continuing, you agree to the use of cookies.

⁰