Study on the novel process of reducing subsurface damage in grinding by Magnetorheological Finishing

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Study on the novel process of reducing subsurface damage in grinding by Magnetorheological Finishing

Article | 更新时间：2020-08-12

- Study on the novel process of reducing subsurface damage in grinding by Magnetorheological Finishing
- Optics and Precision Engineering Vol. 18, Issue 1, Pages: 162-168(2010)
- 作者机构：
  
  国防科学技术大学，机电工程与自动化学院，机电系，精密工程实验室2. 国防科大机电工程与自动化学院3. 国防科技大学机电工程与自动化学院机电系4. 国防科学技术大学机电工程与自动化学院机电系
- 作者简介：
- 基金信息：
- DOI：
  CLC：
- Received：06 March 2009，
  
  Revised：21 April 2009，
  
  Published Online：22 January 2010，
  
  Published：22 January 2010
- 稿件说明：
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石峰,戴一帆,彭小强,王卓. 磁流变抛光消除磨削亚表面损伤层工艺研究[J]. 光学精密工程, 2010,18(1):162-168

Study on the novel process of reducing subsurface damage in grinding by Magnetorheological Finishing[J]. Optics and precision engineering, 2010, 18(1): 162-168.
石峰,戴一帆,彭小强,王卓. 磁流变抛光消除磨削亚表面损伤层工艺研究[J]. 光学精密工程, 2010,18(1):162-168 DOI：

Study on the novel process of reducing subsurface damage in grinding by Magnetorheological Finishing[J]. Optics and precision engineering, 2010, 18(1): 162-168. DOI：

摘要

针对传统光学制造技术对亚表面控制局限性和磁流变抛光的特点，提出用磁流变抛光替代研磨工序直接衔接磨削工序的新工艺流程。采用自研的磁流变抛光机床KDMRF−1000和水基磁流变抛光液KDMRW-2进行了磁流变抛光去除磨削亚表面损伤层的实验研究。直径为100mm的K9材料平面玻璃，经过156min的磁流变粗抛，去除50um深度的亚表面损伤层，表面粗糙度Ra值提升至0.926nm，经过17.5min磁流变精抛，去除了200nm深度的材料，并消除磁流变粗抛产生的抛光纹路，表面粗糙度Ra值提升至0.575nm。应用磁流变抛光可以高效消除磨削产生的亚表面损伤层。磁流变抛光替代研磨工序直接衔接磨削工序的新工艺流程可以实现近零亚表面损伤和纳米精度抛光两个工艺目标。

Abstract

Based on the low subsurface damage in Magnetorheological Finishing (MRF) process

a novel optical machining process is introduced to continue with grinding by MRF rather than lapping. Experimental research on this novel process

reducing subsurface damage caused by grinding by MRF

is finished with KDMRF-1000F polishing machine and KDMRW-2 water based MR fluids. One K9 flat (100mm in diameter) is rough polished (depth 50um

156min) and surface roughness Ra is 0.926nm. Then

it is finishing polished (depth 200nm

17.5min) to remove the ripples caused by rough polish and final surface roughness Ra is 0.575nm. The result shows that MRF is a low subsurface damage deterministic process

which results in high surface roughness (below 1nm)

low subsurface damage and high machining efficiency.

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