Smile effect and package technique for diode laser arrays

WANG Xiang-peng; LI Zai-jin; LIU Yun; WANG Li-jun

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Smile effect and package technique for diode laser arrays

Article | 更新时间：2020-08-13

- Smile effect and package technique for diode laser arrays
- Optics and Precision Engineering Vol. 18, Issue 3, Pages: 552-557(2010)
- 作者机构：
  
  1. 中国科学院研究生院北京,100039
  2. 中国科学院长春光学精密机械与物理研究所激发态实验室,吉林长春,130033
- 作者简介：
- 基金信息：
- DOI：
  CLC：
- Received：23 March 2009，
  
  Revised：22 October 2009，
  
  Published Online：22 March 2010，
  
  Published：22 March 2010
- 稿件说明：
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王祥鹏,,李再金,,刘云,王立军. 半导体激光器列阵的smile效应与封装技术[J]. 光学精密工程, 2010,18(3):552-557

WANG Xiang-peng, LI Zai-jin, LIU Yun, et al. Smile effect and package technique for diode laser arrays[J]. Optics and precision engineering, 2010, 18(3): 552-557.
王祥鹏,,李再金,,刘云,王立军. 半导体激光器列阵的smile效应与封装技术[J]. 光学精密工程, 2010,18(3):552-557 DOI：

WANG Xiang-peng, LI Zai-jin, LIU Yun, et al. Smile effect and package technique for diode laser arrays[J]. Optics and precision engineering, 2010, 18(3): 552-557. DOI：

摘要

为了减小半导体激光器列阵在封装过程中引入热应力而产生的smile效应，提高半导体激光器列阵光束质量，利用对半导体激光器列阵发光点成像放大的方法，准确测量了半导体激光器列阵的smile效应，测量误差为±0.1 μm。由于smile效应的准确测量能客观地比较减小smile效应的各种技术与方法，本文根据分析测量结果，提出了通过优化封装半导体激光器列阵焊接回流曲线的方法，使smile效应值控制在±0.5 μm内。该方法减小了半导体激光器列阵的smile效应值，提高了激光器列阵光束质量，为下一步研制小芯径、高光束质量半导体激光器列阵光纤耦合模块提供了基础条件。

Abstract

To reduce the smile effect caused by the thermal stress and to improve the beam quality of laser diode arrays

a set of optical system is designed for measuring the smile effect. By using an image amplification method

the smile effect of a laser diode array is accurately measured

and the measurement error is about ±0.1 μm. The quantitative characterization of the smile effect is a key technology to compare objectively the different measuring methods for smile effect and to reduce or eliminate the smile effect. According to analysis of the measurement results

the diode laser array package technique about reflow soldering is optimized

and the smile effect has been controlled within ±0.5 μm. As the smile effect values of the laser diode array is decreased and the beam quality of the laser diode array is improved significantly

the proposed method provides a technological fundation for development of small fiber diameters and high beam quality diode lasers.

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