The micro electrode array has wide used both in the micro-fabrication field and the life science field. In this paper

UV-LIGA technology was investigated to fabricate the ultra-high micro electrode array

and the micro electrochemical machining was used as an aided method to remove the SU-8 resist. During the lithography process

SU-8 mold up to 1mm thick was fabricated on the substrate. Before the electroforming process

a reverse polarity procedure was carried out to make the micro roots on the substrate

which could enhance the adhesion of the micro copper electrode array electroformed to the substrate. Using the optimized parameters: single coating; soft bake110℃/12h; post bake50℃/5min

70℃/10min

90℃/30min; electrochemcial machining 10V/15min et al.

the micro electrode arrays up to 900μm high with different shapes were fabricated. The result indicates that UV-LIGA is an excellent method for fabricating ultra-high metal micro electrode array.