您当前的位置:
首页 >
文章列表页 >
Micro-vision positioning systems for IC packaging
Article | 更新时间:2020-08-13
    • Micro-vision positioning systems for IC packaging

    • Optics and Precision Engineering   Vol. 18, Issue 4, Pages: 965-972(2010)
    • Received:04 June 2009

      Revised:09 September 2009

      Published Online:22 April 2010

      Published:22 April 2010

    移动端阅览

  • LI Jun-lan, ZHANG Da-wei, WANG Yi-zhong, et al. Micro-vision positioning systems for IC packaging[J]. Optics and precision engineering, 2010, 18(4): 965-972. DOI:

  •  
  •  

0

Views

19

下载量

8

CSCD

Alert me when the article has been cited
提交
Tools
Download
Export Citation
Share
Add to favorites
Add to my album

Related Articles

Visual inspection for assembly conformity of wing cable brackets
Review of MEMS vibration-mirror-based 3D reconstruction of structured light
System parameter calibration based on a specular and diffuse calibration plate
Template matching with multi-feature co-occurrence matrix
Vision measurement of pitch and profile deviations for small modulus gears with unknown parameters

Related Author

GE Xinxin
CUI Haihua
LI Pengcheng
WANG Xin
LI Xinghui
ZHANG Zonghua
ZHANG Chenping
HAN Min

Related Institution

College of Mechanical & Electrical Engineering, Nanjing University of Aeronautics and Astronautics
School of Mechanical Engineering, Hebei University of Technology
Shenzhen International Graduate School, Tsinghua University
National Key Laboratory of Strength and Structural Integrity,Aircraft Strength Research Institute of China
College of Mechanical Engineering, Xi'an Jiaotong University
0