Three-dimensional coordinate measurement of microstructures based on nano measuring machine

Jun-jie WU

doi:10.37188/OPE.20202810.2252

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Three-dimensional coordinate measurement of microstructures based on nano measuring machine

Micro/Nano Technology and Fine Mechanics | 更新时间：2020-11-16

- Three-dimensional coordinate measurement of microstructures based on nano measuring machine
- Optics and Precision Engineering Vol. 28, Issue 10, Pages: 2252-2259(2020)
- 作者机构：
  
  上海市计量测试技术研究院机械与制造计量技术研究所, 上海 201203
- 作者简介：
- 基金信息：
- DOI：10.37188/OPE.20202810.2252
  CLC： TH711
- Received：07 April 2020，
  
  Revised：11 May 2020，
  
  Accepted：11 May 2020，
  
  Published：25 October 2020
- 稿件说明：
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Jun-jie WU. Three-dimensional coordinate measurement of microstructures based on nano measuring machine[J]. Optics and precision engineering, 2020, 28(10): 2252-2259.
DOI：

Jun-jie WU. Three-dimensional coordinate measurement of microstructures based on nano measuring machine[J]. Optics and precision engineering, 2020, 28(10): 2252-2259. DOI： 10.37188/OPE.20202810.2252.

摘要

针对当前微纳米测量中存在的微结构跨尺度、高精度测量及高深宽比结构多参数表征问题，基于纳米测量机和微接触测头构建了纳米坐标测量系统。通过对测头与定位平台机械、电气及软件接口的设计，实现测头与平台的集成，并利用标准球对测量系统进行校准。为保证测量结果的可溯源性，对定位平台三轴激光干涉仪的激光器进行了拍频。最后，利用搭建的测量系统对高度10

m，2 mm的超高台阶及硅臂卡爪的侧壁倾角进行了测量，表明系统具备大尺寸结构的高精度测量和复杂MEMS器件特征尺寸的精确表征能力。

Abstract

To realize the trans-scale and high-precision measurement of microstructures

as well as to perform multiple geometrical parameter characterizations of some high-aspect-ratio structures

a nano coordinate measurement system was developed based on a nano measurement machine and a micro tactile probe. The mechanical

electrical

and software interfaces between the probe and positioning platform were designed. After the integration of the probe and positioning platform

the measurement system was calibrated using a standard micro ball. To ensure traceability of the measurement results

the laser sources of three interferometers in the positioning platform were also calibrated using the laser beat frequency. Finally

ultra-high steps with heights of 10

m and 2 mm and the sidewall angle of a silicon arm were measured using the developed system. The experiments indicated that the system can accurately measure large-size structures and complex MEMS devices.

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Keywords

references

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Related Institution

College of Electronic Science and Technology, Institute of Micro-nano Photoelectronic Technology, Shenzhen University

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