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1.Changcheng Institute of Metrology and Measurement, Aviation Industry Corporation of China, Ltd., Beijing 100095, China
2.School of Instrumentation and Optoelectronic Engineering, Beihang University, Beijing 100191, China
3.Department of Stress Analysis, Centre of Excellence for Advanced Materials, Dongguan 523808, China
Published:15 May 2021,
Received:14 October 2020,
Revised:14 January 2021,
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石伟,张凯林,侯晓东.边缘凸起式超显微硬度压痕的共聚焦测量[J].光学精密工程,2021,29(05):1014-1023.
SHI Wei,ZHANG Kai-lin,HOU Xiao-dong.Confocal microscopic measurement of ultramicro hardness considering indentation pile-up[J].Optics and Precision Engineering,2021,29(05):1014-1023.
石伟,张凯林,侯晓东.边缘凸起式超显微硬度压痕的共聚焦测量[J].光学精密工程,2021,29(05):1014-1023. DOI: 10.37188/OPE.20212905.1014.
SHI Wei,ZHANG Kai-lin,HOU Xiao-dong.Confocal microscopic measurement of ultramicro hardness considering indentation pile-up[J].Optics and Precision Engineering,2021,29(05):1014-1023. DOI: 10.37188/OPE.20212905.1014.
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