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1.广东科技学院,广东 东莞 523083
2.华南理工大学 机械与汽车工程学院,广东 广州 510640
Received:18 March 2022,
Revised:02 May 2022,
Published:10 July 2022
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陈绒,陈钊杰,谢晋.微孔气流加压对ITO玻璃激光刻蚀平面度的影响[J].光学精密工程,2022,30(13):1564-1571.
CHEN Rong,CHEN Zhaojie,XIE Jin.Influence of micropore airflow pressurization on flatness of laser etched ITO glass[J].Optics and Precision Engineering,2022,30(13):1564-1571.
陈绒,陈钊杰,谢晋.微孔气流加压对ITO玻璃激光刻蚀平面度的影响[J].光学精密工程,2022,30(13):1564-1571. DOI: 10.37188/OPE.20223013.1564.
CHEN Rong,CHEN Zhaojie,XIE Jin.Influence of micropore airflow pressurization on flatness of laser etched ITO glass[J].Optics and Precision Engineering,2022,30(13):1564-1571. DOI: 10.37188/OPE.20223013.1564.
针对ITO玻璃表面线路激光刻蚀中因定位问题玻璃工件产生的微变形,采用微孔陶瓷对工件进行微气流阵列加压,确保高精度的激光刻蚀加工。分析不同加工工艺下的微气流压力分布,探究气流压力和刻蚀间隙对ITO玻璃刻蚀表面平面度的作用机制。结果表明:经微孔气流加压后,工件在气体流动的区域受到正压力,加工区域的压力分布较为均匀。由此可知,工件表面受到均布气压有利于刻蚀表面的定位,但过大的压力会导致工件微变形。实验结果显示:在合适的压力下,微孔气流加压可使得平面度低至8 μm,当压力在0.16~0.2 kPa,刻蚀间隙在1.8~1.9 mm时,工件表面压力为13.2~14.4 Pa,此时平面度最好,微米尺度的刻蚀线路清晰,不产生破损。最后,对微孔气流加压的ITO玻璃进行激光刻蚀加工,可得到8 μm以及25 μm的表面微细线路,解决了通常无微孔气流加压的刻蚀工艺导致局部断点或变形线路引起产品短路或开路等问题。
During laser etching of indium tin oxide (ITO) glass, micro-deformation of the glass workpiece, which results from positioning problems, causes breakpoints or deformation of micro-scale etching lines, resulting in short circuits and open circuits in adjacent areas. Therefore, during the laser etching of ITO glass surface lines, microporous ceramics are typically used to pressurize the workpiece with airflow from a micro-hole array to ensure high-precision laser etching. In this study, the micropore airflow pressure distribution under different processing techniques was analyzed, and the influence of the gas flow pressure and the etching gap on the flatness of the etched surface of the ITO glass was explored. The results revealed that after being pressurized by the microporous airflow, the workpiece is subjected to a positive pressure in the area where the gas flows so that the pressure distribution in the processing area is relatively uniform. Such a uniform air pressure on the surface of the workpiece can prove beneficial for the positioning of the etched surface; however, an excessive pressure may lead to micro-deformation of the workpiece. The experimental results indicate that the flatness can be as low as 8 μm under an appropriate pressure, and at a pressure of 0.16-0.2 kPa and an etching gap of 1.8-1.9 mm, the surface pressure of the workpiece becomes 13.2-14.4 Pa. At this time, the surface degree is the best, and the etched lines on the micron scale are clear and do not cause damage. Finally, the laser etching process of an ITO glass pressurized using a micro-hole airflow was conducted, and surface fine lines of 8 μm and 25 μm could be etched. This resolved the issues of short circuits or open circuits in the product, which are typically caused by local breakpoints or deformations resulting from the etching process, which is usually conducted in the presence of air without micropores.
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