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Material removal and surface damage behavior of diamond grain for flexible scribing RB-SiC
Micro/Nano Technology and Fine Mechanics | 更新时间:2022-08-08
    • Material removal and surface damage behavior of diamond grain for flexible scribing RB-SiC

    • Optics and Precision Engineering   Vol. 30, Issue 14, Pages: 1704-1715(2022)
    • DOI:10.37188/OPE.20223014.1704    

      CLC: TG580.6
    • Received:18 April 2022

      Revised:19 May 2022

      Published:25 July 2022

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  • WANG Yaru,LI Yingjie,ZOU Lai,et al.Material removal and surface damage behavior of diamond grain for flexible scribing RB-SiC[J].Optics and Precision Engineering,2022,30(14):1704-1715. DOI: 10.37188/OPE.20223014.1704.

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