Non-vertical ball grid array interconnection of ceramic package for high-performance DC-55 GHz application

LIU Linjie; HAO Yue; ZHOU Yangfan; WANG Ke; QIAO Zhizhuang

doi:10.37188/OPE.20233103.0363

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Non-vertical ball grid array interconnection of ceramic package for high-performance DC-55 GHz application

Micro/Nano Technology and Fine Mechanics | 更新时间：2023-02-15

- Non-vertical ball grid array interconnection of ceramic package for high-performance DC-55 GHz application
- Optics and Precision Engineering Vol. 31, Issue 3, Pages: 363-370(2023)
- 作者机构：
  
  1.西安电子科技大学，陕西西安 710000
  2.中国电子科技集团公司第十三研究所，河北石家庄 050000
- 作者简介：
- 基金信息：
- DOI：10.37188/OPE.20233103.0363
  CLC： TN405;TN958.92
- Received：26 August 2022，
  
  Revised：03 September 2022，
  
  Published：10 February 2023
- 稿件说明：
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刘林杰,郝跃,周扬帆等.DC-55 GHz高性能焊球阵列封装用非垂直互连结构[J].光学精密工程,2023,31(03):363-370.

LIU Linjie,HAO Yue,ZHOU Yangfan,et al.Non-vertical ball grid array interconnection of ceramic package for high-performance DC-55 GHz application[J].Optics and Precision Engineering,2023,31(03):363-370.
刘林杰,郝跃,周扬帆等.DC-55 GHz高性能焊球阵列封装用非垂直互连结构[J].光学精密工程,2023,31(03):363-370. DOI： 10.37188/OPE.20233103.0363.

LIU Linjie,HAO Yue,ZHOU Yangfan,et al.Non-vertical ball grid array interconnection of ceramic package for high-performance DC-55 GHz application[J].Optics and Precision Engineering,2023,31(03):363-370. DOI： 10.37188/OPE.20233103.0363.

摘要

根据5G信号对通道带宽的要求，通过研究陶瓷基板中“类同轴”互连的微波特性，设计了一种新型非垂直互连结构，通过陶瓷介电层之间金属化通孔的错位设计，改善垂直过孔与水平传输线转弯处的阻抗突变，更有利于高频信号的传输，进一步扩展带宽。分析了错位角度、阶梯级数、焊球半径和焊球间距对传输性能的影响，设计并实现了宽带低损耗互连陶瓷基板。测试结果表明，该结构的最高应用频率可达55 GHz，在DC-55 GHz频带内插入损耗小于1.5 dB，回波损耗大于15 dB，同时利用实测数据进行信号传输验证，结果表明在未引入预加重、均衡的情况下即可满足56 G/112 G NRZ，112 G PAM4高速信号的传输。

Abstract

The advent of 5G technology has spurred rapid advancements in high-speed signal development， leading to increasing bandwidth requirements for signal channels. This study examines the microwave characteristics of "quasi-coaxial" interconnections in ceramic substrates and proposes a novel non-vertical interconnection structure. By optimizing the design of metallized vias between ceramic layers， the impedance at the junction of vertical vias and horizontal transmission lines is improved， enhancing high-frequency signal transmission and broadening bandwidth. The paper analyzes the effect of misalignment angle， ladder series， solder ball radius， and distance between solder balls on transmission performance. The result is a broadband， low-loss ceramic substrate interconnection. Experimental results show that the structure can operate at 55 GHz with an insertion loss less than 1.5 dB and a return loss greater than 15 dB in the DC-55 GHz band. The measured data demonstrate satisfactory transmission of 56 G/112 G NRZ and 112 G PAM4 high-speed signals without the need for preweighting and equalization.

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references

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