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Bump height measurement of chip packaging based on white light triangulation
Modern Applied Optics | Updated:2023-07-17
    • Bump height measurement of chip packaging based on white light triangulation

    • Optics and Precision Engineering  
    • DOI:10.37188/OPE.20233113.1890    

      CLC: TH741
    • Published:10 July 2023

      Received:02 November 2022

      Revised:21 December 2022

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  • Cite this article

  • LIN Xianjin,WU Zuwei,YE Ruiqian,et al.Bump height measurement of chip packaging based on white light triangulation[J].Optics and Precision Engineering,2023,31(13):1890-1899. DOI: 10.37188/OPE.20233113.1890.

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