1.School of Aerospace Engineering, Xiamen University, Xiamen 361102, China
Published:10 July 2023,
Received:02 November 2022,
Revised:21 December 2022,
Scan for full text
Cite this article
林贤锦,吴祖伟,叶瑞乾等.基于白光三角法的芯片封装凸点高度测量[J].光学精密工程,2023,31(13):1890-1899.
LIN Xianjin,WU Zuwei,YE Ruiqian,et al.Bump height measurement of chip packaging based on white light triangulation[J].Optics and Precision Engineering,2023,31(13):1890-1899.
林贤锦,吴祖伟,叶瑞乾等.基于白光三角法的芯片封装凸点高度测量[J].光学精密工程,2023,31(13):1890-1899. DOI: 10.37188/OPE.20233113.1890.
LIN Xianjin,WU Zuwei,YE Ruiqian,et al.Bump height measurement of chip packaging based on white light triangulation[J].Optics and Precision Engineering,2023,31(13):1890-1899. DOI: 10.37188/OPE.20233113.1890.
0
Views
20
Downloads
0
CSCD
Publicity Resources
Related Articles
Related Author
Related Institution