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Modeling and experimental study on material removal rate of quartz wafer by fixed abrasive lapping
Micro\/Nano Technology and Fine Mechanics | 更新时间:2026-09-11
    • Modeling and experimental study on material removal rate of quartz wafer by fixed abrasive lapping

    • Optics and Precision Engineering   Vol. 31, Issue 16, Pages: 2362-2371(2023)
    • DOI:10.37188/OPE.20233116.2362    

      CLC: TH161+.1;TG73
    • Received:08 March 2023

      Revised:2023-04-08

      Published:25 August 2023

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  • JIA Yufan,ZHU Xianglong,YANG Lei,et al.Modeling and experimental study on material removal rate of quartz wafer by fixed abrasive lapping[J].Optics and Precision Engineering,2023,31(16):2362-2371.

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OPE Cover | Modeling and experimental study on material removal rate of consolidated abrasive grinding quartz wafer

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