Influence of water in magnetic compound fluid on polishing performance

WANG Youliang; GAO Xichun; ZHANG Wenjuan; GUO Jiang

doi:10.37188/OPE.20233124.3559

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Influence of water in magnetic compound fluid on polishing performance

Micro\/Nano Technology and Fine Mechanics | 更新时间：2026-09-11

- Influence of water in magnetic compound fluid on polishing performance
- Optics and Precision Engineering Vol. 31, Issue 24, Pages: 3559-3569(2023)
- 作者机构：
  
  1.兰州理工大学机电工程学院，甘肃兰州 730000
  2.兰州理工大学有色金属先进加工与再利用国家重点实验室，甘肃兰州 730000
  3.大连理工大学机械工程学院，辽宁大连 116024
  4.大连理工大学宁波研究院，浙江宁波 315016
- 作者简介：
- 基金信息：
- DOI：10.37188/OPE.20233124.3559
  CLC： TG580
- Received：13 July 2023，
  
  Revised：2023-08-10，
  
  Published：25 December 2023
- 稿件说明：
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王有良,高熙淳,张文娟等.磁性复合流体抛光过程中水分对抛光性能的影响[J].光学精密工程,2023,31(24):3559-3569.

WANG Youliang,GAO Xichun,ZHANG Wenjuan,et al.Influence of water in magnetic compound fluid on polishing performance[J].Optics and Precision Engineering,2023,31(24):3559-3569.
王有良,高熙淳,张文娟等.磁性复合流体抛光过程中水分对抛光性能的影响[J].光学精密工程,2023,31(24):3559-3569. DOI： 10.37188/OPE.20233124.3559.

WANG Youliang,GAO Xichun,ZHANG Wenjuan,et al.Influence of water in magnetic compound fluid on polishing performance[J].Optics and Precision Engineering,2023,31(24):3559-3569. DOI： 10.37188/OPE.20233124.3559.

摘要

磁性复合流体（Magnetic Compound Fluid，MCF）具有优异的抛光性能，然而MCF抛光液中的水分在抛光过程中流失，抛光性能随之降低，这将增加抛光成本并严重影响MCF抛光的工程应用。针对磁性复合流体抛光液在抛光过程中水分流失的问题，探究了抛光过程中MCF水分含量对MCF形貌特征、抛光区域温度、正压力与抛光质量的关系，构建MCF中水分对抛光质量的影响机理。首先，分析了抛光过程中不同水分占比抛光液对抛光性能的影响规律，采用工业相机观察MCF抛光液抛光前后的形貌特征。然后，通过总结抛光过程温升-磁流体状态-抛光作用力-抛光质量的内在联系，构建不同水分含量MCF的抛光机理。最后，通过向MCF抛光液中定量补充水分，有效地缓解了MCF抛光液抛光效果降低的问题。实验结果表明：（1）当MCF抛光液水分占比为45%时初始抛光效果较好，抛光10 min内工件的表面粗糙度由0.410 μm下降到0.007 μm；而使用已持续抛光50 min的MCF加工10 min后工件的表面粗糙度由0.576 μm下降到0.173 μm。MCF随着抛光时间的增加MCF抛光性能大幅下降；（2）随着抛光液中含水量的降低，抛光时磁性颗粒形成的链状结构恢复能力变差，进而影响其抛光性能；（3）在抛光过程中向MCF抛光液补充水分后，抛光结束时工件的表面粗糙度下降率由无添加时的69.97%提高至86.69%，材料去除率由0.95×10

μm

/min提升到1.45×10

/min，抛光正压力由3.7 N提升到4.2 N。当抛光过程中补充水分，使MCF的水含量占比维持在45%左右时，可以保持其长效稳定的抛光能力，有效地延长MCF的使用寿命。

Abstract

Magnetic compound fluids （MCFs） have been shown to exhibit excellent polishing performance. However， problems with water wastage in MCF slurries during the polishing process can deteriorate their performance. This increases the costs of polishing using MCF slurries significantly， which substantially limits the application of MCF polishing technology. To address the issue of water loss in an MCF slurry， the relationships between the MCF's water content and the morphology， polishing temperature， normal pressure， and polishing quality of the MCF were investigated. The mechanism of the influence of moisture on polishing quality was also evaluated. First， the influences of different water content levels on the polishing properties of the fluid were analyzed. Additionally， the morphological characteristics of the MCF slurry before and after polishing were observed using industrial cameras. Then， the polishing mechanism of the MCF with varying water contents was examined by summarizing the internal relationship between temperature increases， the state of the MCF， and the force exerted in the polishing process as well as the quality of the resulting surface. Finally， the shortened lifespan of the MCF slurry was effectively alleviated by adding water. The following key results were obtained. （1） The initial polishing was better when the water content of the MCF polishing liquid was maintained at 45%. After 10 min of polishing， the surface roughness of the workpiece decreased from 0.410 μm to 0.007 μm using the initial MCF slurry. In contrast， it decreased from 0.576 μm to 0.173 μm using the MCF slurry that had been used for 50 min. The polishing performance of the MCF significantly decreased with increasing polishing time. （2） The ability of the MCF to recover worsened with decreasing water content in the slurry， which in turn affected its polishing pe

rformance. （3） The rate of decrease of the roughness of the polished surface after 60 min of polishing increased from 69.97% initially to 86.69% after adding water to the MCF slurry. The rate at which material was removed increased from 0.95×10

μm

/min to 1.45×10

μm

/min， and the normal force of the polishing increased from 3.7 N to 4.2 N. When water is added to an MCF slurry during the polishing process， maintaining a water content of approximately 45% can improve the long-term stable polishing ability of the slurry and extend the service life of the MCF effectively.

关键词

Keywords

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