您当前的位置:
首页 >
文章列表页 >
Influence of water in magnetic compound fluid on polishing performance
Micro/Nano Technology and Fine Mechanics | 更新时间:2023-12-28
    • Influence of water in magnetic compound fluid on polishing performance

    • Optics and Precision Engineering   Vol. 31, Issue 24, Pages: 3559-3569(2023)
    • DOI:10.37188/OPE.20233124.3559    

      CLC: TG580
    • Received:13 July 2023

      Revised:10 August 2023

      Published:25 December 2023

    移动端阅览

  • WANG Youliang,GAO Xichun,ZHANG Wenjuan,et al.Influence of water in magnetic compound fluid on polishing performance[J].Optics and Precision Engineering,2023,31(24):3559-3569. DOI: 10.37188/OPE.20233124.3559.

  •  
  •  

0

Views

268

下载量

0

CSCD

Alert me when the article has been cited
提交
Tools
Download
Export Citation
Share
Add to favorites
Add to my album

Related Articles

Modification of nickel slag and application in magnetic compound fluid polishing
Modeling of removal function and optimization of process parameters for robotic polishing M-ZnS
Process development of small size copper-plated InP wafer with 8-inch CMP equipment
Modeling and experimental study on material removal rate of quartz wafer by fixed abrasive lapping
Optimization of process parameters and surface characteristics in laser-assisted ultra-precision cutting of monocrystalline silicon

Related Author

WANG Youliang
YU Puyao
YIN Xincheng
ZHANG Wenjuan
ZANG Yikai
ZHU Beibei
QIN Lin
SHANG Yao

Related Institution

Key Laboratory of Digital Manufacturing Technology and Application, Ministry of Education of China, Lanzhou University of Technology
School of Mechanical and Electronical Engineering, Lanzhou University of Technology
School of Mechanical Engineering, Hubei University of Technology
Shanghai Aerospace Control Technology Research Institute
School of Mechanical Science and Engineering, Huazhong University of Science and Technology
0