Prediction of brittle-to-ductile transition depth in ultra-precision grinding YAG crystals

AO Mengcan; HUANG Jinxing; ZENG Yuxian; WU Yueqin; KANG Renke; GAO Shang

doi:10.37188/OPE.20243201.0084

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Prediction of brittle-to-ductile transition depth in ultra-precision grinding YAG crystals

Micro/Nano Technology and Fine Mechanics | 更新时间：2024-01-13

- Prediction of brittle-to-ductile transition depth in ultra-precision grinding YAG crystals
- Optics and Precision Engineering Vol. 32, Issue 1, Pages: 84-94(2024)
- 作者机构：
  
  1.大连理工大学高性能精密制造全国重点实验室，辽宁大连 116024
  2.华侨大学制造工程研究院，福建厦门 361021
- 作者简介：
- 基金信息：
- DOI：10.37188/OPE.20243201.0084
  CLC： TN305.2;O786
- Published：10 January 2024，
  
  Received：14 September 2023，
  
  Revised：11 October 2023，
- 稿件说明：
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敖萌灿,黄金星,曾毓贤等.超精密磨削YAG晶体的脆塑转变临界深度预测[J].光学精密工程,2024,32(01):84-94.

AO Mengcan,HUANG Jinxing,ZENG Yuxian,et al.Prediction of brittle-to-ductile transition depth in ultra-precision grinding YAG crystals[J].Optics and Precision Engineering,2024,32(01):84-94.
敖萌灿,黄金星,曾毓贤等.超精密磨削YAG晶体的脆塑转变临界深度预测[J].光学精密工程,2024,32(01):84-94. DOI： 10.37188/OPE.20243201.0084.

AO Mengcan,HUANG Jinxing,ZENG Yuxian,et al.Prediction of brittle-to-ductile transition depth in ultra-precision grinding YAG crystals[J].Optics and Precision Engineering,2024,32(01):84-94. DOI： 10.37188/OPE.20243201.0084.

摘要

钇铝石榴石（YAG）晶体是制造固体激光器的重要材料，超精密磨削是加工YAG晶体等硬脆材料零件的重要方法，研究硬脆材料加工表面的微观变形、脆塑转变机理对超精密磨削加工具有重要的指导作用。为了实现YAG晶体低损伤磨削加工，获得高质量表面，基于弹塑性接触理论和压痕断裂力学，通过分析单磨粒划擦作用下材料表面的变形过程，考虑材料的弹性回复、微观下力学性能的尺寸效应，建立了脆塑转变临界深度的预测模型，并计算得到YAG晶体的脆塑转变临界深度为66.7 nm。在此基础上，通过不同粒度砂轮超精密磨削YAG晶体试验对建立的脆塑转变临界深度预测模型进行验证，并计算不同粒度砂轮在相应工艺条件下的磨粒切深。结果表明，磨粒切深高于脆塑转变临界深度时，YAG晶体磨削表面材料以脆性方式被去除，磨削表面损伤严重；磨粒切深低于脆塑转变临界深度时，磨削表面材料以塑性方式被去除，能够获得高质量磨削表面，加工表面粗糙度达到1 nm。建立的脆塑转变临界深度预测模型能够为YAG晶体的低损伤超精密磨削加工提供理论指导。

Abstract

Yttrium aluminum garnet （YAG） crystals are widely used for manufacturing solid-state lasers， and ultraprecision grinding is critical for machining hard and brittle material parts， such as YAG crystals. The investigation of microdeformation and brittle-to-ductile transition mechanisms of hard and brittle material-machined surfaces is necessary for ultraprecision grinding. Based on the elastic-plastic contact theory and indentation fracture mechanics， a model for predicting the critical depth of brittle-to-ductile transitions was established to achieve low-damage grinding of YAG crystals and obtain high-quality surfaces. The deformation process of the material surface under the action of a single abrasive scratch was analyzed， considering the elastic recovery of the material and the size effect of micromechanical properties. The critical depth of the brittle-to-ductile transition of the YAG crystal is 66.7 nm. The proposed prediction model of the critical depth of the brittle-to-ductile transition was verified by ultraprecision grinding of YAG crystals with grinding wheels of different grain sizes. In addition， the grit-cutting depths of different grain-size grinding wheels under the corresponding process conditions were calculated. The results show that when the grit-cutting depth is more extended than the critical depth of the brittle-to-ductile transition， the surface material of the YAG crystal is removed in a brittle manner， and the grinding surface is severely damaged. However， when the grit-cutting depth is less than the critical depth of the brittle-to-ductile transition， the grinding surface material is removed in a ductile manner， high-quality grinding surface can be obtained， and the machined surface roughness can reach 1 nm. The proposed model for predicting the critical depth of the brittle-to-ductile transition provides theoretical guidance for low-damage ultraprecision grinding of YAG crystals.

关键词

超精密磨削YAG晶体纳米压痕纳米划痕脆塑转变

Keywords

YAG crystalnano-indentationnano-scratchbrittle-to-ductile transitionultra-precision grinding

references

MILISAVLJEVIC I， ZHANG G， WU Y. Solid-state single-crystal growth of YAG and Nd∶YAG by spark plasma sintering［J］. Journal of Materials Science & Technology， 2022， 106： 118-127. doi: 10.1016/j.jmst.2021.08.014http://dx.doi.org/10.1016/j.jmst.2021.08.014

FENG Z， MA C Y， ZHANG C G， et al. Transparent YAG ceramic/sapphire composite fabricated by pressureless direct thermal diffusion bonding［J］. Journal of the European Ceramic Society， 2021， 41（15）： 7845-7851. doi: 10.1016/j.jeurceramsoc.2021.08.020http://dx.doi.org/10.1016/j.jeurceramsoc.2021.08.020

NEGRI J R， PIRZIO F， AGNESI A. Jitter investigation of narrow-bandwidth passively Q-switched Nd： YAG unidirectional ring laser［J］. Optics Letters， 2019， 44（12）： 3094-3097. doi: 10.1364/ol.44.003094http://dx.doi.org/10.1364/ol.44.003094

BORDATCHEV E V， HAFIZ A M K， TUTUNEA-FATAN O R. Performance of laser polishing in finishing of metallic surfaces［J］.The International Journal of Advanced Manufacturing Technology， 2014， 73（1/2/3/4）： 35-52. doi: 10.1007/s00170-014-5761-3http://dx.doi.org/10.1007/s00170-014-5761-3

SACHDEVA A， PICKERING E M， LEE H J. From electrocautery， balloon dilatation， neodymium-doped： yttrium-aluminum-garnet （Nd∶YAG） laser to argon plasma coagulation and cryotherapy［J］. Journal of Thoracic Disease， 2015， 7（Suppl 4）： S363-S379.

MINCUZZI G， PALMA A L， DI CARLO A， et al. Laser processing in the manufacture of dye-sensitized and perovskite solar cell technologies［J］. ChemElectroChem， 2016， 3（1）： 9-30. doi: 10.1002/celc.201500389http://dx.doi.org/10.1002/celc.201500389

位超杰，闫仁鹏，李旭东，等. 三维成像激光雷达应用的亚纳秒激光器研究进展［J］. 光学精密工程， 2021， 29（6）：1270-1280. doi: 10.37188/ope.20212906.1270http://dx.doi.org/10.37188/ope.20212906.1270

WEI CH J， YAN R P， LI X D， et al. Research progress of sub-nanosecond lasers for 3D imaging lidar［J］. Opt. Precision Eng.， 2021， 29（6）：1270-1280.（in Chinese）. doi: 10.37188/ope.20212906.1270http://dx.doi.org/10.37188/ope.20212906.1270

ROSS D， YAMAGUCHI H. Nanometer-scale characteristics of polycrystalline YAG ceramic polishing［J］. CIRP Annals， 2018， 67（1）： 349-352. doi: 10.1016/j.cirp.2018.04.090http://dx.doi.org/10.1016/j.cirp.2018.04.090

MCKAY J， BAI T Y， GOORSKY M S. Chemical mechanical polishing and direct bonding of YAG［J］. ECS Transactions， 2018， 86（5）： 217-222. doi: 10.1149/08605.0217ecsthttp://dx.doi.org/10.1149/08605.0217ecst

PEI Z J， FISHER G R， LIU J. Grinding of silicon wafers： a review from historical perspectives［J］. International Journal of Machine Tools and Manufacture， 2008， 48（12/13）： 1297-1307. doi: 10.1016/j.ijmachtools.2008.05.009http://dx.doi.org/10.1016/j.ijmachtools.2008.05.009

刘宁，朱永伟，李学，等. 硬脆材料平面研抛的材料去除机理研究进展［J］. 材料导报， 2022， 36（7）：80-91. doi: 10.11896/cldb.21060121http://dx.doi.org/10.11896/cldb.21060121

LIU N， ZHU Y W， LI X， et al. Research progress of material removal mechanism in plane lapping and polishing of hard-brittle materials［J］. Materials Review， 2022， 36（7）：80-91.（in Chinese）. doi: 10.11896/cldb.21060121http://dx.doi.org/10.11896/cldb.21060121

袁巨龙，王志伟，文东辉，等. 超精密加工现状综述［J］. 机械工程学报， 2007， 43（1）：35-48. doi: 10.3321/j.issn:0577-6686.2007.01.006http://dx.doi.org/10.3321/j.issn:0577-6686.2007.01.006

YUAN J L， WANG ZH W， WEN D H， et al. Review of the current situation of ultra-precision machining［J］. Chinese Journal of Mechanical Engineering， 2007， 43（1）：35-48.（in Chinese）. doi: 10.3321/j.issn:0577-6686.2007.01.006http://dx.doi.org/10.3321/j.issn:0577-6686.2007.01.006

SUN J L， CHEN P， QIN F， et al. Modelling and experimental study of roughness in silicon wafer self-rotating grinding［J］. Precision Engineering， 2018， 51： 625-637. doi: 10.1016/j.precisioneng.2017.11.003http://dx.doi.org/10.1016/j.precisioneng.2017.11.003

ZHANG C Y， GUO B， ZHAO Q L， et al. Ultra-precision grinding of AlON ceramics： surface finish and mechanisms［J］. Journal of the European Ceramic Society， 2019， 39（13）： 3668-3676. doi: 10.1016/j.jeurceramsoc.2019.05.005http://dx.doi.org/10.1016/j.jeurceramsoc.2019.05.005

JIANG B C， ZHAO D W， LIU Y H， et al. Surface figure control in fine rotation grinding process of thick silicon mirror［J］.The International Journal of Advanced Manufacturing Technology， 2018， 98（1/2/3/4）： 771-779. doi: 10.1007/s00170-018-2328-8http://dx.doi.org/10.1007/s00170-018-2328-8

高尚，李天润，郎鸿业，等. 工件旋转法磨削硅片的亚表面损伤深度预测［J］. 光学精密工程， 2022， 30（17）：2077-2087. doi: 10.37188/OPE.20223017.2077http://dx.doi.org/10.37188/OPE.20223017.2077

GAO SH， LI T R， LANG H Y， et al. Prediction for subsurface damage depth of silicon wafers in workpiece rotational grinding［J］. Opt. Precision Eng.， 2022， 30（17）：2077-2087.（in Chinese）. doi: 10.37188/OPE.20223017.2077http://dx.doi.org/10.37188/OPE.20223017.2077

李琛. 稀土氧化物激光晶体超精密磨削机理及工艺研究［D］. 哈尔滨：哈尔滨工业大学， 2019.

LI C. Study on Ultra-precision Grinding Mechanism and Technology of Rare Earth Oxide Laser Crystal［D］. Harbin： Harbin Institute of Technology， 2019. （in Chinese）

LI C， LI X L， WU Y Q， et al. Deformation mechanism and force modelling of the grinding of YAG single crystals［J］. International Journal of Machine Tools and Manufacture， 2019， 143： 23-37. doi: 10.1016/j.ijmachtools.2019.05.003http://dx.doi.org/10.1016/j.ijmachtools.2019.05.003

BIFANO T G， DOW T A， SCATTERGOOD R O. Ductile-regime grinding： a new technology for machining brittle materials［J］. Journal of Engineering for Industry， 1991， 113（2）： 184-189. doi: 10.1115/1.2899676http://dx.doi.org/10.1115/1.2899676

HUANG H， LAWN B R， COOK R F， et al. Critique of materials-based models of ductile machining in brittle solids［J］. Journal of the American Ceramic Society， 2020， 103（11）： 6096-6100. doi: 10.1111/jace.17344http://dx.doi.org/10.1111/jace.17344

ARIF M， ZHANG X Q， RAHMAN M， et al. A predictive model of the critical undeformed chip thickness for ductile-brittle transition in nano-machining of brittle materials［J］. International Journal of Machine Tools and Manufacture， 2013， 64： 114-122. doi: 10.1016/j.ijmachtools.2012.08.005http://dx.doi.org/10.1016/j.ijmachtools.2012.08.005

VENKATACHALAM S， LI X， LIANG S Y.Predictive modeling of transition undeformed chip thickness in ductile-regime micro-machining of single crystal brittle materials［J］. Journal of Materials Processing Technology， 2009， 209（7）： 3306-3319. doi: 10.1016/j.jmatprotec.2008.07.036http://dx.doi.org/10.1016/j.jmatprotec.2008.07.036

LI H G， GAO S， KANG R K， et al. The Deformation Pattern of Aluminum Nitride Ceramics Under Nanoscratching［M］. Proceedings of the 7th International Conference on Nanomanufacturing （nanoMan2021）. Singapore： Springer Singapore， 2022： 285-297. doi: 10.1007/978-981-19-1918-3_32http://dx.doi.org/10.1007/978-981-19-1918-3_32

JIANG W， CHENG X W， CAI H， et al. The response of yttrium aluminum garnet （YAG） grains and grain boundaries to nanoindentation［J］. Journal of Materials Science. 2018， 53（24）： 16198-16206. doi: 10.1007/s10853-018-2782-6http://dx.doi.org/10.1007/s10853-018-2782-6

LI C， ZHANG F H， WANG X， et al. Investigation on surface/subsurface deformation mechanism and mechanical properties of GGG single crystal induced by nanoindentation［J］. Applied Optics， 2018， 57（14）： 3661-3668. doi: 10.1364/ao.57.003661http://dx.doi.org/10.1364/ao.57.003661

WANG H M， HUANG Z Y， LU Z W， et al. Determination of the elastic and plastic deformation behaviors of Yb： Y3Al5O12 transparent ceramic by nanoindentation［J］. Journal of Alloys and Compounds， 2016， 682： 35-41. doi: 10.1016/j.jallcom.2016.04.241http://dx.doi.org/10.1016/j.jallcom.2016.04.241

HUANG Y， ZHANG F， HWANG K C， et al. A model of size effects in nano-indentation［J］. Journal of the Mechanics and Physics of Solids， 2006， 54（8）： 1668-1686. doi: 10.1016/j.jmps.2006.02.002http://dx.doi.org/10.1016/j.jmps.2006.02.002

PHARR G M， HERBERT E G， GAO Y F. The indentation size effect： a critical examination of experimental observations and mechanistic interpretations［J］. Annual Review of Materials Research， 2010， 40： 271-292. doi: 10.1146/annurev-matsci-070909-104456http://dx.doi.org/10.1146/annurev-matsci-070909-104456

LI C， ZHANG F H， PIAO Y C. Strain-rate dependence of surface/subsurface deformation mechanisms during nanoscratching tests of GGG single crystal［J］. Ceramics International， 2019， 45（12）： 15015-15024. doi: 10.1016/j.ceramint.2019.04.238http://dx.doi.org/10.1016/j.ceramint.2019.04.238

GAO S， LI H G， KANG R K， et al. Effect of strain rate on the deformation characteristic of AlN ceramics under scratching［J］. Micromachines， 2021， 12（1）： 77. doi: 10.3390/mi12010077http://dx.doi.org/10.3390/mi12010077

OLIVER W C， PHARR G M. An improved technique for determining hardness and elastic modulus using load and displacement sensing indentation experiments［J］.Journal of Materials Research， 1992， 7（6）： 1564-1583. doi: 10.1557/jmr.1992.1564http://dx.doi.org/10.1557/jmr.1992.1564

PATHAK S， KALIDINDI S R. Spherical nanoindentation stress-strain curves［J］. Materials Science and Engineering， 2015， 91： 1-36. doi: 10.1016/j.mser.2015.02.001http://dx.doi.org/10.1016/j.mser.2015.02.001

LAWN B R， EVANS A G. A model for crack initiation in elastic/plastic indentation fields［J］.Journal of Materials Science， 1977， 12（11）： 2195-2199. doi: 10.1007/bf00552240http://dx.doi.org/10.1007/bf00552240

MAH T I， PARTHASARATHY T A. Effects of temperature， environment， and orientation on the fracture toughness of single-crystal YAG［J］. Journal of the American Ceramic Society， 1997， 80（10）： 2730-2734. doi: 10.1111/j.1151-2916.1997.tb03185.xhttp://dx.doi.org/10.1111/j.1151-2916.1997.tb03185.x

ZHANG Y， KANG R K， GAO S， et al. A new model of grit cutting depth in wafer rotational grinding considering the effect of the grinding wheel， workpiece characteristics， and grinding parameters［J］. Precision Engineering， 2021， 72： 461-468. doi: 10.1016/j.precisioneng.2021.06.007http://dx.doi.org/10.1016/j.precisioneng.2021.06.007

YANG M， LI C H， ZHANG Y B， et al. Maximum undeformed equivalent chip thickness for ductile-brittle transition of zirconia ceramics under different lubrication conditions［J］. International Journal of Machine Tools and Manufacture， 2017， 122： 55-65. doi: 10.1016/j.ijmachtools.2017.06.003http://dx.doi.org/10.1016/j.ijmachtools.2017.06.003

YIN L， VANCOILLE E Y J， RAMESH K， et al. Surface characterization of 6H-SiC （0001） substrates in indentation and abrasive machining［J］. International Journal of Machine Tools and Manufacture， 2004， 44（6）： 607-615. doi: 10.1016/j.ijmachtools.2003.12.006http://dx.doi.org/10.1016/j.ijmachtools.2003.12.006

马廉洁，巩亚东，顾立晨，等. 可加工微晶玻璃陶瓷磨削表面成形机制［J］. 机械工程学报， 2017， 53（15）： 201-207. doi: 10.3901/jme.2017.15.201http://dx.doi.org/10.3901/jme.2017.15.201

MA L J， GONG Y D， GU L CH， et al. Mechanism of surface forming in grinding machinable glass ceramics［J］. Journal of Mechanical Engineering， 2017， 53（15）： 201-207.（in Chinese）. doi: 10.3901/jme.2017.15.201http://dx.doi.org/10.3901/jme.2017.15.201

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