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Process development of small size copper-plated InP wafer with 8-inch CMP equipment
Micro/Nano Technology and Fine Mechanics | 更新时间：2024-02-22

    • Process development of small size copper-plated InP wafer with 8-inch CMP equipment

    • Optics and Precision Engineering   Vol. 32, Issue 3, Pages: 392-400(2024)

    • DOI：10.37188/OPE.20243203.0392    

      CLC： TN405

    • Received：26 July 2023，

      Revised：22 August 2023，

      Published：10 February 2024

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  • CHENG Ming,ZHAO Dongxu,WANG Yunpeng,et al.Process development of small size copper-plated InP wafer with 8-inch CMP equipment[J].Optics and Precision Engineering,2024,32(03):392-400. DOI： 10.37188/OPE.20243203.0392.

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