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北京理工大学 光电学院 复杂环境智能感测技术工信部重点实验室,北京 100081
Received:13 November 2023,
Revised:2023-11-30,
Published:10 April 2024
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李兆宇,刘子豪,王瑶莹等.高精度激光共焦半导体晶圆厚度测量[J].光学精密工程,2024,32(07):956-965.
LI Zhaoyu,LIU Zihao,WANG Yaoying,et al.High-precision laser confocal measurement of semiconductor wafer thickness[J].Optics and Precision Engineering,2024,32(07):956-965.
李兆宇,刘子豪,王瑶莹等.高精度激光共焦半导体晶圆厚度测量[J].光学精密工程,2024,32(07):956-965. DOI: 10.37188/OPE.20243207.0956.
LI Zhaoyu,LIU Zihao,WANG Yaoying,et al.High-precision laser confocal measurement of semiconductor wafer thickness[J].Optics and Precision Engineering,2024,32(07):956-965. DOI: 10.37188/OPE.20243207.0956.
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