您当前的位置：
首页 >
文章列表页 >
Visual inspection of soldering defects on board surfaces against complex backgrounds
Information Sciences | 更新时间：2024-09-03
|

    • Visual inspection of soldering defects on board surfaces against complex backgrounds

    • “在PCB缺陷检测领域，研究者提出了PCBNet，通过DeConv和SPD-Conv减少信息丢失，增强细微特征感知能力，实现了高效准确的缺陷识别。”
    • Optics and Precision Engineering   Vol. 32, Issue 14, Pages: 2256-2271(2024)

    • DOI：10.37188/OPE.20243214.2256    

      CLC： TP394.1;TH691.9

    • Published：25 July 2024，

      Received：13 March 2024，

      Revised：27 May 2024，

    移动端阅览

  • ZHU Liying,WANG Sen,SHEN Aiping,et al.Visual inspection of soldering defects on board surfaces against complex backgrounds[J].Optics and Precision Engineering,2024,32(14):2256-2271. DOI： 10.37188/OPE.20243214.2256.

  •  
  •  

0

Views

9

下载量

0

CSCD

Alert me when the article has been cited
提交
Tools
Download
Export Citation
Share
Add to favorites
Add to my album

Related Articles

Few-shot warhead fragment group object detection based on feature reassembly and attention
Position-sensitive Transformer aerial image object detection model
Audio object detection network with multimodal cross level feature knowledge transfer
Flue-cured tobacco leaf grade detection through multi-receptive field features fusing adaptively and dynamic loss adjustment
Micron-level processing technology of microlens array （MLA） photolithography based on convolutional neural network

Related Author

LIU Qianghui
HE Xuan
REN Yuan
HU Pengyu
LIANG Chao
WU Jiangpeng
HE Meng
LI Daxiang

Related Institution

Xi’an Modern Control Technology Research Institute
College of communication and information engineering， Xi'an University of Posts and Telecommunication
Key Laboratory of Advanced Process Control for Light Industry （Ministry of Education）， Jiangnan University
Tung Sah Institute of Micro-Nano Science and Technology， Xiamen University
Innovation Laboratory for Sciences and Technologies of Energy Materials of Fujian Province （IKKEM）
0