Chemical mechanical grinding for quartz glass

QIU Zhong-jun; ZHOU Li-bo; FANG Feng-zhou; SHINA Tsuyoshi; EDA Hiroshi

doi:10.3788/OPE.20101807.1554

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Chemical mechanical grinding for quartz glass

Article | 更新时间：2020-08-12

- Chemical mechanical grinding for quartz glass
- Optics and Precision Engineering Vol. 18, Issue 7, Pages: 1554-1561(2010)
- 作者机构：
  
  1. 天津大学精密测试技术及仪器国家重点实验室天津,300072
  2. 日本茨城大学工学部,茨城日立,316-8511
- 作者简介：
- 基金信息：
- DOI：10.3788/OPE.20101807.1554
  CLC：
- Received：14 September 2009，
  
  Revised：17 November 2009，
  
  Published Online：30 July 2010，
  
  Published：20 July 2010
- 稿件说明：
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仇中军, 周立波, 房丰洲, 椎名刚志, 江田弘. 石英玻璃的化学机械磨削加工[J]. 光学精密工程, 2010,18(7): 1554-1561

QIU Zhong-jun, ZHOU Li-bo, FANG Feng-zhou, SHINA Tsuyoshi, EDA Hiroshi. Chemical mechanical grinding for quartz glass[J]. 光学精密工程, 2010,18(7): 1554-1561
仇中军, 周立波, 房丰洲, 椎名刚志, 江田弘. 石英玻璃的化学机械磨削加工[J]. 光学精密工程, 2010,18(7): 1554-1561 DOI： 10.3788/OPE.20101807.1554.

QIU Zhong-jun, ZHOU Li-bo, FANG Feng-zhou, SHINA Tsuyoshi, EDA Hiroshi. Chemical mechanical grinding for quartz glass[J]. 光学精密工程, 2010,18(7): 1554-1561 DOI： 10.3788/OPE.20101807.1554.

摘要

为了实现石英玻璃基板的高效、高质量加工

进一步改善光掩模设备的性能

进行了石英玻璃化学机械磨削(CMG)加工技术的研究。通过在磨削过程中主动增强磨粒、结合剂以及磨削液与工件的化学反应

并使化学反应与机械去除作用形成动态平衡

从而消除因材料脆性去除而造成的表面损伤等

实现了大口径玻璃工件的高表面质量、高形状精度的加工。针对石英玻璃CMG加工的特点

开发了CMG专用砂轮及磨削液

利用正交实验法优化了石英玻璃CMG加工工艺参数

分析了CMG加工过程中磨削压力、砂轮转速、磨削液流量、pH值等因素对加工表面粗糙度及加工效率的影响

并利用优化后的工艺参数加工得到了

为0.795 nm的石英玻璃表面。加工后基板的光学性能和化学机械抛光(CMP)加工基板的光学性能相同

能够满足光掩模设备的性能需求。

Abstract

To achieve a high-quality quartz glass substrate and to improve the performance of photomask equipment

a Chemical Mechanical Grinding (CMG) method for the quartz glass is developed. By actively enhancing the chemical reactions of the workpiece and the abrasive grain

bond and the grinding fluid and dynamically balancing the chemical reaction and mechanical remove

the process method can avoid the sub-surface damage caused by eliminating the brittle material to achieve high surface quality and high shape precision processing of a large-diameter glass workpiece. For the processing characteristics of CMG for the quartz glass

this paper develops the CMG-specific wheel and grinding fluid. Then it uses orthogonal experiment method to optimize the CMG process parameters for the quartz glass

and analyzes the effects of the grinding pressure

wheel speed

grinding fluid traffic

pH value and other factors on the surface roughness and processing efficiency in CMG processing.On the basis of the optimized processing parameters

it obtains the surface roughness of quartz glass in 0.795 nm. Obtained results show that the finished substrates have the same optical performance with the substrates processed by Chemical Mechanical Polishing(CMP)

and the performance can meet the needs of photomask equipment.

关键词

Keywords

references

ZHOU L B, SHINA T, QIU ZH J. Research on chemo-mechanical grinding of large size quartz glass substrate [J]. Precision Engineering, 2009,33:499-504.

张银霞, 郜伟, 康仁科. 单晶硅片磨削的表面相变[J]. 光学精密工程, 2008,16(8):1440-1445. ZHANG Y X, GAO W, KAN G R K. Phase transformations of grinding monocrystall ine silicon w afer surface [J]. Opt. Precision Eng.,2008,16(8):1440-1445. (in Chinese)

BRINKSMEIER E,HEINZEL C,WITTMANN M. Friction, cooling and lubrication in grinding[J]. CIRP Annals, 1999,48:581-598.

VENKATESH V C,LZMAN S. Development of a novel binderless diamond grinding wheel for machining IC chips for failure analysis[J]. Journal of Materials Processing Technology, 2007,185:31-37.

周立波, 河合真二, 本田将之. Si ウエハのChemo-Mechanical-Grinding(CMG)に関する研究[J]. 精密工学会誌, 2002,68(12):1559-1563. ZHOU L B, HONDA K S.Masayuki research on chemo-mechanical-grinding (CMG) of Si wafer [J]. Journal of JSPE, 2002,68(12):1559-1563. (in Japanese)

SINHOFF V. Generative precision grinding of optical glass[J]. Annals of the ClRP, 1998,47:253-258.

SURATWALA T,WONG L,MILLER P. Sub-surface mechanical damage distributions during grinding of fused silica [J]. Journal of Non-Crystalline Solids, 2006,352:5601-5617.

HUANG H, WANG B L, WANG Y. Characteristics of silicon substrates fabricated usin nanogrinding and chemo mechanical grinding [J]. Materials Science and Engineering A, 2008, 479:373-379.

王慧军, 张飞虎, 赵航, 等. 超声波磁流变复合抛光中几种工艺参数对材料去除率的影响[J]. 光学精密工程, 2007,15(10):1583-1588. WANG H J, ZHANG F H, ZHAO H, et al.. Effect of several processing parameters on material removal ratio in ultrasonic-magnetorheological compound finishing[J]. Opt. Precision Eng., 2007,15(10):1583-1588. (in Chinese)

谢晋, 阮兆武. 光学自由曲面反射镜模芯的镜面成型磨削[J]. 光学精密工程,2007,17(3):344-349. XIE J, RUAN ZH W. Mirror form grinding of free-form surface of reflector mould core [J]. Opt. Precision Eng., 2007,17(3):344-349. (in Chinese)

孟庆华, 向阳. 高精度测量光学玻璃折射率的新方法[J]. 光学精密工程, 2008,16(11):2114-2119. MENG Q H, XIANG Y. Novel high accurate measurement method for refractive index of optical glass [J]. Opt. Precision Eng., 2008,16(11):2114-2119. (in Chinese)

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