Fabrication of metal micro hole array by using over-plating technology

HU Yang-yang; ZHU Di; LI Han-song

doi:10.3788/OPE.20101808.1793

您当前的位置：

首页 >

文章列表页 >

Fabrication of metal micro hole array by using over-plating technology

Article | 更新时间：2020-08-12

- Fabrication of metal micro hole array by using over-plating technology
- Optics and Precision Engineering Vol. 18, Issue 8, Pages: 1793-1800(2010)
- 作者机构：
  
  南京航空航天大学江苏省精密与微细制造技术重点实验室,江苏南京,210016
- 作者简介：
- 基金信息：
- DOI：10.3788/OPE.20101808.1793
  CLC： TG662;TN305.7
- Received：09 October 2009，
  
  Revised：26 November 2009，
  
  Published Online：20 August 2010，
  
  Published：20 August 2010
- 稿件说明：
移动端阅览
胡洋洋, 朱荻, 李寒松. 采用过电铸工艺制造金属微细阵列网板[J]. 光学精密工程, 2010,18(8): 1793-1800

HU Yang-yang, ZHU Di, LI Han-song. Fabrication of metal micro hole array by using over-plating technology[J]. 光学精密工程, 2010,18(8): 1793-1800
胡洋洋, 朱荻, 李寒松. 采用过电铸工艺制造金属微细阵列网板[J]. 光学精密工程, 2010,18(8): 1793-1800 DOI： 10.3788/OPE.20101808.1793.

HU Yang-yang, ZHU Di, LI Han-song. Fabrication of metal micro hole array by using over-plating technology[J]. 光学精密工程, 2010,18(8): 1793-1800 DOI： 10.3788/OPE.20101808.1793.

摘要

针对制作尺度

10 m的超小微细阵列网板非常困难的问题

提出了采用过电铸工艺制造超小尺寸微细阵列网板的方法。建立了过电铸工艺过程的电场模型

利用有限元分析技术对过电铸工艺过程进行模拟仿真。选取优化的工艺参数(烘胶 120 ℃/60 min

曝光 3 000 mJ/cm

显影 2 min等)利用光刻制作了高度为50 m、直径为50 m的AZ EXP 125nXT-10A光刻胶群柱结构

以此胶膜结构作为模具进行了过电铸工艺实验

并与仿真结果进行对比

结果证明了有限元仿真的正确性。最后

通过过电铸缩孔2 h获得了厚度达70 m

孔径为4 m的微细阵列网板结构。实验表明

过电铸工艺是一种低廉、安全、可批量生产的制作超小阵列网板的方法。

Abstract

The over-plating technology was introduced to fabricate micro hole arrays

for it is difficult to fabricate a micro hole array with the size less than 10 m by traditional methods. A mathematical model was presented to simulate the over-plating process by Finite Element Method (FEM). Using the optimized parameters (bake 120 ℃/60 min

exposure 3 000 mJ/cm

and development 2 min)

the AZ EXP 125nXT-10A resist structure in a diameter of 50 m and a height of 50 m was prepared

and then the over-plating technology was employed to shrink the micro hole. The experimental result shows that the simulation result is correct. Finally

a micro hole array in a diameter of 4 m and a height of 70 m was fabricated after over-plating 2 h. The result indicates that over-plating is a simple and low cost method to fabricate micro hole array

and it is suitable for batch production.

关键词

Keywords

references

刘福顺,徐惠彬,宫声凯,等. EB-PVD热障涂层对激光打孔孔径及热循环后孔径变化影响的研究[J]. 航空学报,2003,24(2):178-182.

LIU F S, XU H B, GONG SH K, et al.. Investigation on effect of EB-PVD thermal barrier coatings on diameters of gaseous envelope cool and thermal circles[J]. Acta Aeronautica ET Astronautica Sinica, 2003,24(2):178-182. (in Chinese)

CHUNG C K,LIN C J,CHEN C C, et al.. Combination of thick resist and electroforming technologies for monolithic inkjet application[J]. Microsystem Technologies, 2004,10(6-7):462-466.

郭磊,杨崇倡,戴惠良,等. 喷丝板大长径比微小导孔加工工艺[J]. 工具技术,2008, 42(1):97-99.

GUO L, YANG CH CH, DAI H L, et al.. Machining technology of large length-diameter ratio pilot micro-hole of spinneret[J]. Tool Technology, 2008,42(1):97-99. (in Chinese)

WANG W, ZHU D,ALLEN D M, et al.. Non-traditional machining techniques for fabricating metal aerospace filters[J]. Chinese Journal of Aeronautics, 2008,21(5):441-447.

GOUKLER B R. Metal stencil overview [J]. SMT Surface Mount Technology Magazine, 2001,15(4):84-87.

DATTA M. Fabrication of an array of precision nozzles by through-mask electro chemical micromachining[J]. Journal of Electrochemical Society, 1995,142 (11):655-669.

巴瑞璋, 张晓兵. 激光加工密集群孔技术[J]. 航空制造技术, 2003,(7):68-71.

BA ZH R, ZHANG X B. Large machining closely spaced holes[J]. Aeronautical Manufacturing Technology, 2003,(7):68-71.(in Chinese)

TAKAHATA K, GIANCHANDANI Y B. Batch mode micro-electro-discharge machining[J].Microelectromech.Syst, 2002,11(2):102-110.

MING P M, ZHU D, ZHOU F, et al.. Fabrication of metal micro-precision sieves with high open areas using UV-LIGA process[J]. Optics and Precision Engineering, 2009,17(6):1267-1273.

崔峰,靖向萌,赵小林,等. SU-8胶模去除技术[J]. 微细加工技术,2007(1):1-6.

CUI F, JING X M, ZHAO X L, et al.. Techniques for remove of SU-8 photoresist mold [J]. Microfabrication Technology, 2007(1):1-6. (in Chinese)

CHEN CH W, PLASS B, EDWARD N, et al.. Development of thick negative photoresists for electroplating applications [J]. Advances in Resist Materials and Processing Technology XXV, 2008,6923:69233E-1-69233E-8.

Views

474

下载量

CSCD

Alert me when the article has been cited

提交

Tools

Publicity Resources

Effect of alignment errors of reticle on distortion in lithographic projection lens

Study on curved compound eye imaging system

Error analysis of fabricating isometric mesh on the concave of a spherical substrate by concentric optical scanning

The study of LIGA technology

The Application of Excimer Laser Deep Lithography in LIGA Process

Related Author

SHANG Hong-bo

HUANG Wei

YANG Wang

SUN Qiang

LIU Hua

LI Feng-you

WANG Rui-ting

LU Zhen-wu

Related Institution

Changchun Institute of Optics, Fine Mechanics and Physics, Chinese Academy of Sciences

University of Chinese Academy of Sciences

State Key Laboratory of Applied Optics, Changchun Institute of Optics, Fine Mechanics and Physics, Chinese Academy of Sciences

Graduate School of the Chinese Academy of Sciences, Beijing 100039, China

College of Mathematics, Jilin University

AI问答

Address：No.3888 Dong Nanhu Road, Changchun, Jilin, China Postal code：130033
Tel：0431-86176855 Email：gxjmgc@ciomp.ac.cn
Technical support is provided by Beijing Founder electronics co., LTD 吉ICP备11002662号-17 京公网安备11010802024621
It is recommended to read the content of this site in Chrome&IE9+. Please switch to extreme mode in browser 360.
Cookies We use cookies to help provide and enhance our service and tailor content. By continuing, you agree to the use of cookies.

⁰