Fabrication of single-crystal silicon vibrating ring gyroscope

ZHANG Ming; CHEN De-yong; WANG Jun-bo

doi:10.3788/OPE.20101811.2454

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Fabrication of single-crystal silicon vibrating ring gyroscope

Article | 更新时间：2020-08-12

- Fabrication of single-crystal silicon vibrating ring gyroscope
- Optics and Precision Engineering Vol. 18, Issue 11, Pages: 2454-2460(2010)
- 作者机构：
  
  中国科学院电子学研究所传感技术国家重点实验室北方基地北京,100190
- 作者简介：
- 基金信息：
- DOI：10.3788/OPE.20101811.2454
  CLC： U666.123
- Received：10 March 2010，
  
  Revised：20 April 2010，
  
  Published Online：25 November 2010，
  
  Published：25 November 2010
- 稿件说明：
移动端阅览
张明, 陈德勇, 王军波. 单晶硅振动环陀螺仪的制作[J]. 光学精密工程, 2010,18(11): 2454-2460

ZHANG Ming, CHEN De-yong, WANG Jun-bo. Fabrication of single-crystal silicon vibrating ring gyroscope[J]. Editorial Office of Optics and Precision Engineering, 2010,18(11): 2454-2460
张明, 陈德勇, 王军波. 单晶硅振动环陀螺仪的制作[J]. 光学精密工程, 2010,18(11): 2454-2460 DOI： 10.3788/OPE.20101811.2454.

ZHANG Ming, CHEN De-yong, WANG Jun-bo. Fabrication of single-crystal silicon vibrating ring gyroscope[J]. Editorial Office of Optics and Precision Engineering, 2010,18(11): 2454-2460 DOI： 10.3788/OPE.20101811.2454.

摘要

为了简化电容式振动环陀螺仪的制作方法

进一步提高成品率

提出了一种结合反应离子深刻蚀(DRIE)与阳极键合的陀螺仪制备方法。分析了振动环陀螺的工作原理

指出了传统工艺存在的缺陷;对该制作方法所采用的工艺流程进行了详细设计

分析了不同工艺参数对陀螺仪性能的影响

并依据分析和实验结果改进了工艺流程和参数。最后

采用该方法制作了振动环式微机械陀螺仪并进行了测试。实验结果表明

采用该方法能成功制作电容间隙为3 m、厚度为80 m的振动环式陀螺仪微结构。与传统的制作方法相比

工艺流程大为简化

掩模板数量从7块减少到2块

满足器件性能可靠、工艺简单、成品率高的要求。

Abstract

In order to simplify the fabrication process of a vibrating ring gyroscope and to improve its finished products

a fabricating method combing Deep Reactive Ion Etching(DRIE) and anodic bonding technologies was proposed to fabricate sensor structures. The operating principles of the vibrating ring gyroscope and the technological drawbacks in the traditional fabrication process were discussed. Then

the processing flows based on DRIE and anodic bonding technologies were carefully designed

and the effect of different technological parameter on the gyroscope performance was analyzed. On the basis of the analyzed results

the technological flows and parameters were modified. Finally

a single-crystal silicon vibrating ring gyroscope with a high aspect ratio was fabricated and tested. Experimental results indicate that the proposed method can fabricate a vibrating ring gyroscope with 3 m capacitance gaps and 80 m depth.In comparison with traditional fabrication technologies

the number of masks has been reduced from 7 to 2

which meets the device requirements for simplicity and stabilization.

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Keywords

references

<td valign='top'>[1]KAZUSUKE M, SUNAO I, NOBUHIRO S, et al..Design, fabrication and operation of MEMS gimbal gyroscope [J].Sensors and Actuators A,2005(121):6-15.<td valign='top'>[2]SAID E A, KIVANC A, TAYFUNA A. A high-performance silicon-on insulator MEMS gyroscope operating at atmospheric pressure [J].Sensors and Actuators A,2007(135):34-42.<td valign='top'>[3]SUNGSU P, ROBERTO H, CHIN-WOO T. Dynamics and control of a MEMS angle Measuring Gyroscope [J].Sensors and Actuators A. 2008(144):56-63.<td valign='top'>[4]FARROKH A, KHALIL N. A HARPSS polysilicon vibrating ring gyroscope [J]. Journal of Microelectromechanical System,2001,10(2):169-179.<td valign='top'>[5]CHANG S,CHIA M,CASTILLO-BORELLEY P, et al..An electroformed CMOS integrated angular rate sensor[J].Sensors and Actuators A,1998(66):138-143.<td valign='top'>[6]FARROKH A, KHALIL N. Design and fabrication of a high-performance polysilicon vibrating ring gyroscope . Eleventh IEEE/ASME International Workshop on Micro Electro Mechanical Systems,1998:25-29.<td valign='top'>[7]MICHAEL W P. A micromachined vibrating ring gyroscope . USA:University of Michigan,1995.<td valign='top'>[8]FARROKH A. A high aspect-ratio high performance polysilicon vibrating ring gyroscope .USA:University of Michigan,2000.<td valign='top'>[9]陈李,陈德勇,王军波,等. 高性能电磁式微机械振动环陀螺[J]. 光学精密工程,2009,17(8):1916-1921. CHEN L, CHEN D Y, WANG J B, et al.. High performance electromagnetic micro-machined ring vibration gyroscope [J]. Opt. Precision Eng., 2009,17(8):1916-1921.(in Chinese)<td valign='top'>[10]CHEN L, CHEN D Y, WANG J B, et al.. Micro-machined vibrating ring gyroscope [J].Opt. Precision Eng., 2009,17(6):1344-1349.<td valign='top'>[11]陈李,陈德勇,王军波,等. 一种电磁式微机械振动环陀螺的建模与优化[J]. 纳米技术与精密工程,2009,7(3):233-238. CHEN L, CHEN D Y, WANG J B, et al..Mathematical modeling and optimization design of an electromagnetic micro-machined vibrating ring gyroscope [J].Nanotechnology and Precision Engineering.2009,7(3):233-238.(in Chinese)

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