Thermal design of electric cabinet for high-resolution space camera

CHEN Li-heng; XU Shu-yan

doi:10.3788/OPE.20111901.0069

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Thermal design of electric cabinet for high-resolution space camera

Article | 更新时间：2020-08-12

- Thermal design of electric cabinet for high-resolution space camera
- Optics and Precision Engineering Vol. 19, Issue 1, Pages: 69-76(2011)
- 作者机构：
  
  中国科学院长春光学精密机械与物理研究所空间光学部,吉林长春,130033
- 作者简介：
- 基金信息：
- DOI：10.3788/OPE.20111901.0069
  CLC： V242
- Received：26 January 2010，
  
  Revised：13 April 2010，
  
  Published Online：22 January 2011，
  
  Published：22 January 2011
- 稿件说明：
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陈立恒, 徐抒岩. 高分辨率空间相机电控箱热设计[J]. 光学精密工程, 2010,19(1): 69-76

CHEN Li-heng, XU Shu-yan. Thermal design of electric cabinet for high-resolution space camera[J]. Editorial Office of Optics and Precision Engineering, 2010,19(1): 69-76
陈立恒, 徐抒岩. 高分辨率空间相机电控箱热设计[J]. 光学精密工程, 2010,19(1): 69-76 DOI： 10.3788/OPE.20111901.0069.

CHEN Li-heng, XU Shu-yan. Thermal design of electric cabinet for high-resolution space camera[J]. Editorial Office of Optics and Precision Engineering, 2010,19(1): 69-76 DOI： 10.3788/OPE.20111901.0069.

摘要

设计了高分辨率空间相机的电控箱

以解决其散热问题。首先

概述了电控箱热设计的基本流程。然后

采用了加导热片、表面发黑处理、填充导热填料等高可靠性的导热和辐射方式对需要散热的电子元器件、印制电路板以及设备机箱进行散热。通过真空条件下的热试验对热分析模型进行了修正

根据热试验和热分析的结果对热设计提出了增加机外热管的改进措施。最后

根据改进后的措施

利用修正后的模型对热控系统进行了热分析计算。结果表明

改进热控措施后电子元器件的结温温度为40.2~62.7 ℃

表明增加机外热管后器件散热效果明显。改进热控措施后热设计合理

所采取的热控措施能够满足设计要求。

Abstract

A thermal control system of electric cabinet in a high-resolution space camera was designed to resolve its heat dissipation. The basic flow sheet of thermal design for the electric cabinet was introduced

and several kinds of approaches in thermal conductions and thermal radiation were used to dissipate the heat for the electronic components

Printed Circuit Boards (PCBs) and their chassises.Then

the finite element mode of thermal analysis was corrected according to the thermal test in the vacuum condition.Based on the results of thermal test and thermal analysis

the thermal design was modified by adding a heat pipe additionally. Finally

according to the space environment and structure characteristics

the thermal analysis for the thermal control system was performed by the corrected mode and the case temperatures of the electronic components were calculated. The results show that the case temperatures of electronic components are from 40.2 ℃ to 62.7 ℃ after adding the heat pipe

which means the thermal design scheme is feasible and reasonable for the electric cabinets of space cameras.

关键词

Keywords

references

张刘斗.电子设备环境试验的数值模拟与分析研究 . 北京:华北电力大学,2005. ZHANG L D. Numerical simulation and analyses on environment tests for the electronic equipment . Beijing: North China Electric Power University, 2005. (in Chinese)[2] 谢劲松.多芯片组件热分析及热设计技术研究 . 成都:电子科技大学,2005. XIE J S. Study on the thermal analysis and thermal design of MCM .Chendu: University of Electronic Science and Technology of China, 2005. (in Chinese)[3] 王耀霆.电子元件热分析应用研究 . 西安:西北工业大学,2004. WANG Y T. Study on the thermal analysis of electronic components . Xian: Northwesten Polytechnocal University, 2004. (in Chinese)[4] 高新霞.大功率电子元器件及设备结构的热设计研究 . 北京:华北电力大学,2006. GAO X X. Investigation on thermal design of high power electronic components and equipment structure . Beijing: North China Electric Power University, 2006. (in Chinese)[5] 于慈远,于湘珍,杨为民. 电子设备热分析/热设计/热测试技术初步研究[J]. 微电子学,2000,30(5):334-337. YU C Y, YU X ZH, YANG W M. A preliminary study on the techniques for thermal Analysis/Design/Test of Electronic Equipments[J]. Microelectronics. 2000,30(5):334-337. (in Chinese)[6] 吕永超,杨双根. 电子设备热分析、热设计及热测试技术综述及最新进展[J]. 电子机械工程. 2007,23(1):5-10. LV Y CH, YANG SH G. A review of thermal analysis, thermal design and thermal test technology and their recent development [J]. Electro-Mechanical Engineering, 2007,23(1):5-10. (in Chinese)[7] 闵桂荣,郭舜.航天器热控制[M]. 2版.北京:科学出版社,1998. MIN G R, GUO SH. Spacecraft Thermal Control[M]. 2nd ed. Beijing: Science Press,1998. (in Chinese)[8] HARVEST J, FLESCHER S A, WEINTSTEIN R D. Modeling of the thermal effects of heat generating devices in close proximity on vertically oriented printed circuit boards for thermal management applications [J]. International Journal of Thermal Sciences 2007, 46:253-261.[9] FLEISCHER A S, WEINSTEIN R D, KHOBRAGADE S A. Forced convective cooling of electro -optical components maintained at different temperatures on a vertically oriented printed circuit board [J]. IEEE Transactions on Components and Packaging Technology 2004,27(2):296-304.[10] WEISS J, LANGHORST F. Thermal analysis of electronic packaging[J]. Australian Electronics Engineering, 1988,21(8):62-64.[11] DUMERCY L, GLISES R, LOUAHLIA-GUALOUS H, et al.. Thermal management of a PEMFC stack by 3D nodal modeling [J]. Journal of Power Sources, 2006,156:78-84.[12] 陈立恒,吴清文,罗志涛,等. 空间相机电子设备热控系统设计[J]. 光学精密工程,2009,17(9):2145-2152. CHENl L H, WU Q W, LUO ZH T, et al.. Design for thermal control system of electronic equipment in space camera [J].Opt. Precision Eng. , 2009,17(9):2145-2152. (in Chinese)[13] 罗志涛,徐抒岩,陈立恒. 大功率焦平面器件的热控制[J]. 光学精密工程,2008,16(11):2187-2193. LUO ZH T, XU SH Y, CHEN L H. Thermal control of high-power focal plane apparatus[J].Opt. Precision Eng., 2008,16(11):2187-2193. (in Chinese)[14] VELLVEHI M, JORDA X, GODIGNON P, et al.. Coupled electro-thermal simulation of a DC/DC converter [J]. Microelectronics Reliability,2007,47:2114-2121.

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