Experiment of long pulse high energy laser drilling on silica glass

DAI Gang; LU Jian; LIU Jian; ZHANG Liang; NI Xiao-wu

doi:10.3788/OPE.20111902.0380

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Experiment of long pulse high energy laser drilling on silica glass

Article | 更新时间：2020-08-12

- Experiment of long pulse high energy laser drilling on silica glass
- Optics and Precision Engineering Vol. 19, Issue 2, Pages: 380-386(2011)
- 作者机构：
  
  南京理工大学理学院应用物理系,江苏南京,210094
- 作者简介：
- 基金信息：
- DOI：10.3788/OPE.20111902.0380
  CLC： TN249
- Received：08 October 2010，
  
  Revised：30 October 2010，
  
  Published Online：22 February 2011，
  
  Published：22 February 2011
- 稿件说明：
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戴罡, 陆建, 刘剑, 张梁, 倪晓武. 使用长脉冲高能激光对石英玻璃打孔[J]. 光学精密工程, 2011,19(2): 380-386

DAI Gang, LU Jian, LIU Jian, ZHANG Liang, NI Xiao-wu. Experiment of long pulse high energy laser drilling on silica glass[J]. Editorial Office of Optics and Precision Engineering, 2011,19(2): 380-386
戴罡, 陆建, 刘剑, 张梁, 倪晓武. 使用长脉冲高能激光对石英玻璃打孔[J]. 光学精密工程, 2011,19(2): 380-386 DOI： 10.3788/OPE.20111902.0380.

DAI Gang, LU Jian, LIU Jian, ZHANG Liang, NI Xiao-wu. Experiment of long pulse high energy laser drilling on silica glass[J]. Editorial Office of Optics and Precision Engineering, 2011,19(2): 380-386 DOI： 10.3788/OPE.20111902.0380.

摘要

为了实现玻璃上的高效快速打孔

研究了使用长脉冲激光在石英玻璃上打孔的方法。通过在玻璃表面镀制ZrO

解决了石英玻璃对1 064 nm激光吸收弱的问题。使用脉宽为1 ms、波长为1 064 nm的Nd∶YAG激光在石英玻璃上打出了深为1.55 mm的锥形孔。研究了激光打孔的能效比

结果显示

当激光的能量密度为6.8 kJ/cm

左右时

打孔的效能比最大

并分析了可能的原因。根据膜层及基底的吸收系数随温度增加而增加的特性

分析了形成锥形深孔的机理。采用在玻璃的双面都增加吸收层的方法

在玻璃上加工出柱状通孔。最后

分析和讨论了吸收层的热学性质和光学性质对打孔的影响

为提高打孔效率提供了设计方案。实验结果表明

使用单脉冲ms激光能够高效地在玻璃上打出小深孔

为提高玻璃打孔效率提供了新的思路。

Abstract

In order to improve the drilling efficiency of glass

a drilling hole method in the glass with a long pulse laser was investigated. ZrO

was deposited onto the glass to increase the absorption at 1 064 nm. A cone shaped hole with a depth of 1.55 m was obtained by using a Nd∶YAG laser with a pulse duration of 1 ms. The efficiency of drilling holes were studied

which shows that the efficiency reaches the maximum value when the energy density equals 6.8 kJ/cm

.Then

the possible reasons were analyzed. The mechanisms of forming the cone shaped cavity were discussed by considering the property of absorption coefficient of glass that increases with the temperature. The cylindrical holes were obtained in the glass by adding absorption materials on both sides of the glass. Finally

the effects of thermal and optical properties of the absorption layer on the drilling holes were discussed to improve the drilling efficiency. The experiment results show that the single pulse ms laser can drill holes in glass by deposition absorption layers

which provides a new way for improving the drilling efficiency.

关键词

Keywords

references

吴东江,牛方勇,刘双,等. CO2连续激光弯曲硼硅酸盐玻璃薄片的实验研究[J]. 光学精密工程,2008, 16(8):1416-1422. WU D J,NIU F Y,LIU SH, et al.. Borosilicate glass film bending by CO2 CW-laser [J]. Opt. Precision Eng., 2008,16(8):1416-1422.(in Chinese)[2] NIKUMB S, CHEN Q, LI C, et al.. Precision glass machining drilling and profile cutting by short pulse lasers [J]. Thin Solid Films, 2005, 477(1-2):216-221.[3] JIAO J, WANG X B. A numerical simulation of machining glass by dual CO2 laser beams [J]. Optics & Laser Technology, 2008,40(2):297-301.[4] DUBEY A,YADAVA V. Laser beam machining a review[J]. International Journal of Machine Tools and Manufacture, 2008,48(6):609-628.[5] SALMAN N,SHEIKH M A, LI L,et al.. Effect of thermal stresses on chip-free diode laser cutting of glass [J]. Optics & Laser Technology, 2009,41(3):318-327.[6] 魏仁选,姜德生,周祖德. 准分子激光脉冲直写刻蚀速率与能量密度的关系[J]. 光学精密工程,2004, 12(2):231-234. WEI R X,JIANG D SH,ZHOU Z D. Relationship between average etching velocity and laser pulse energy density during excimer laser direct etching [J]. Opt. Precision Eng., 2004, 12(2):231-234.(in Chinese)[7] EGASHIRA K, MIZUTANI K. Ultrasonic vibration drilling of micro holes in glass [J]. CIRP Annals Manufacturing Technology, 2002,50(1):339-342.[8] THORSTEN T,ANDREAS O,CHRISTIAN K, et al.. Precision drilling of fused silica with 157 nm excimer laser radiation [J].SPIE,2003, 4977(40):555-562.[9] LAWRENCE S, JESSE T, MARTIN R, et al.. Femtosecond laser deep hole drilling of silicate glasses in air [J]. Applied Surface Science,2001,183(3-4):151-164.[10] BOLEY C D, CUTTER K P,FOCHS S N, et al.. Interaction of a high power laser beam with metal sheets [J]. Journal of Applied Physics,2010,107(4):043106-043106.5.[11] USOV S V, MINAEV I V. High power impulse YAG laser system for cutting welding and perforating of super hard materials [J]. Journal of Materials Processing Technology,2004, 149(1-3):541-545.[12] 吴东江,马广义,周秋菊,等. 长脉宽脉冲激光硅片弯曲成形试验[J]. 光学精密工程,2007,15(9):1361-1365. WU D J,MA G Y,ZHOU Q J,et al.. Experimental study of bending silicon chip with long pulse width laser [J]. Opt. Precision Eng., 2007,15(9):1361-1365.(in Chinese)[13] TINTEN K S, von der LINDE. Generation of dense electron hole plasmas in silicon [J]. Phys Rev B, 2000,61(4):2643-2650.[14] TINTEN K S, BIALKOWSKI J,LINDE D V. Ultra fast laser-induced order disorder transitions in semiconductors [J]. Phys Rev B, 1995,51(20):14186-14198.

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南京理工大学理学院信息物理与工程系,江苏南京 210094

长春理工大学理学院,吉林长春 130022

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