Experiment and thermal calculation of micro heater

LIU Ze-wen; TIAN Hao; LIU Chong

doi:10.3788/OPE.20111903.0612

您当前的位置：

首页 >

文章列表页 >

Experiment and thermal calculation of micro heater

Article | 更新时间：2020-08-12

- Experiment and thermal calculation of micro heater
- Optics and Precision Engineering Vol. 19, Issue 3, Pages: 612-619(2011)
- 作者机构：
  
  1. 清华大学微电子学研究所,北京 100084
  2. 大连理工大学辽宁省微纳米技术及系统重点实验室,辽宁大连 116024
- 作者简介：
- 基金信息：
- DOI：10.3788/OPE.20111903.0612
  CLC： O551.3;TP212
- Received：06 April 2010，
  
  Revised：02 June 2010，
  
  Published Online：22 March 2011，
  
  Published：22 March 2011
- 稿件说明：
移动端阅览
刘泽文, 田昊, 刘冲. 微加热器热传导试验与计算[J]. 光学精密工程, 2011,19(3): 612-619

LIU Ze-wen, TIAN Hao, LIU Chong. Experiment and thermal calculation of micro heater[J]. Editorial Office of Optics and Precision Engineering, 2011,19(3): 612-619
刘泽文, 田昊, 刘冲. 微加热器热传导试验与计算[J]. 光学精密工程, 2011,19(3): 612-619 DOI： 10.3788/OPE.20111903.0612.

LIU Ze-wen, TIAN Hao, LIU Chong. Experiment and thermal calculation of micro heater[J]. Editorial Office of Optics and Precision Engineering, 2011,19(3): 612-619 DOI： 10.3788/OPE.20111903.0612.

摘要

为了研究微加热膜下方的结构与微加热器性能的关系

利用数值计算与有限元仿真

研究了微加热膜下方空气隙厚度的变化对加热器性能的影响。首先

通过微加热器试验确定了对流换热系数等关键热学计算参数

建立了一维Fourier导热微分方程组

计算了Biot数并以此为依据对模型进行了薄壁简化

使用有限差分法对微分方程进行了数值计算。然后

使用ANSYS有限元分析软件对模型进行了电热耦合仿真

并对在对流换热边界下硅衬底(无空气隙)

100

200

300

400 m气隙以及加热膜(完全贯通)6种模型的瞬态温度响应及稳态热分布的结果进行了对比。计算结果表明

相比硅衬底

目前的微加热膜结构在同样边界条件下可以将最高温度提高约17%。空气隙为200 m时

在+5 V驱动电压和空气对流边界条件下

微加热器可以达到390 K

稳态功耗为134 mW

起到了改善最高温度性能

降低功耗的作用。

Abstract

By utilizing the numerical solution and Finite Element Analysis (FEA) approach

the effect of the air gap beneath a heating membrane on the performemce of a micro heater was calculated and simulated. The thermal convection coefficient was acquired from a heating experiment. Then

a 1D Fourier heat transfer equation was derived.By using the Biot number calculated and the lumped-capacity solution

the model was simplified into a multi-layer thin slab one.Furthermore

the transient temperature response and stable thermal distribution of the air gap in thickness of 0 (pure Si substrate)

100

200

300

400 m and completely through (heating membrane) were compared under the conditions of heat convection and heat transfer. Calculation results show the climax temperature has increased approximately 17% by utilizing the heating membrane structure. The results of steady state and transient thermal-electrical coupled field FEA reveal that 200 m air gap structure indeed enhances the climax temperature to 390 K and reduces the power consumption to 134 mW

which is coherent with the numerical calculation results and experiences.

关键词

Keywords

references

CREEMER J F,BRIAND D,ZANDBERGEN H W,et al..Microhotplates with TiN heaters[J].Sensors and Actuators A: Physical, 2008, 148(2):416-421.[2] TSAI JR H, LIN L.Transient thermal bubble formation on polysilicon micro-resisters[J]. Journal of Heat Transfer, 2002,124(22):375-382.[3] ZHANG K L,CHOU S K,ANG S S. Fabrication, modeling and testing of a thin Au/Ti microheater[J]. International Journal of Thermal Sciences, 2007,46(6):580-588.[4] 王少飞,曹宇,王小宝,等. 激光微细熔覆快速制造微加热器阵列[J]. 中国激光,2007,34(11):1567-1571. WANG S F,CAO Y,WANG X B,et al..Microheater array fabrication by laser micro-cladding method[J].Chinese Journal of Lasers, 2007,34(11):1567-1571.(in Chinese)[5] 闫卫平, 朱剑波, 马灵芝,等. 金属薄膜加热器的研究[J]. 传感技术学报,2004,4(17):615-619. YAN W P,ZHU J B,MA L ZH,et al..Research of metal membrane heater[J].Chinese Journal of Sensors and Actuators,2004,4(17):615-619.[6] 黎仁刚,黄庆安,李伟华. 热电耦合微执行器温度分布的节点分析法[J]. 半导体学报,2005,3(26):562-567. LI R G,HUANG Q A,LI W H. A nodal analysis method for temperature distribution of thermo-electrical coupled thermal microactuators[J].Chinese Journal of Semiconductors, 2005,3(26):562-567. (in Chinese)[7] 罗伟栋. PCR扩增芯片中微加热器结构优化分析[J]. 传感技术学报,2005,3(18):627-631. LUO W D. Analysis and optimization to the structure of micro-heater in PCR Chip[J].Chinese Journal of Sensors and Actuators, 2005,3(18):627-631. (in Chinese)[8] 吴雷, 李铁, 王立春, 等. 微机械面型微加热器的热学分析[J]. 功能材料与器件学报,2005,4(11):466-475. WU L, LI T, WANG L CH,et al..Thermal analysis of MEMS micro-hotplate with uniform temperature in large area[J].Journal of Functional Materials and Device,2005,4(11):466-475. (in Chinese)[9] JOHN H. LIENHARD IV. A Heat Transfer Textbook[M].Houston:Phlogiston Press,2008.[10] 贺永,傅建中,陈子辰. 热压成型装备精密温控研究[J]. 光学精密工程,2008,5(16): 845-851. HE Y,FU J ZH,CHEN Z CH. Temperature precise control in hot embossing device[J].Opt. Precision Eng., 2008,5(16):845-851.(in Chinese)[11] 罗志涛,徐抒岩,陈立恒. 大功率焦平面器件的热控制[J]. 光学精密工程,2008,11(16):2187-2195. LUO ZH T,XU SH Y,CHEN L H. Thermal control of high-power focal plane apparatus[J].Opt. Precision Eng., 2008,11(16):2187-2195.(in Chinese)[12] 刘静. 微米/纳米尺度传热学[M]. 北京:科学出版社,2001. LIU J. Micro/nano Scale Heat Transfer[M]. Beijing: China Science Press, 2001. (in Chinese)[13] 俞昌铭. 热传导及其数值分析[M]. 北京:清华大学出版社,1981. YU CH M. An Numerical Analysis of Heat Conduction[M]. Beijing: Tsinghua University Press,1981. (in Chinese)

Views

861

下载量

CSCD

Alert me when the article has been cited

提交

Tools

Publicity Resources

No data

Related Author

No data

Related Institution

No data

AI问答

Address：No.3888 Dong Nanhu Road, Changchun, Jilin, China Postal code：130033
Tel：0431-86176855 Email：gxjmgc@ciomp.ac.cn
Technical support is provided by Beijing Founder electronics co., LTD 吉ICP备11002662号-17 京公网安备11010802024621
It is recommended to read the content of this site in Chrome&IE9+. Please switch to extreme mode in browser 360.
Cookies We use cookies to help provide and enhance our service and tailor content. By continuing, you agree to the use of cookies.

⁰