Inspection of pseudo solders for lead-free solder joints in PCBs

WU Fu-pei; ZHANG Xian-min

doi:10.3788/OPE.20111903.0697

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Inspection of pseudo solders for lead-free solder joints in PCBs

Article | 更新时间：2020-08-12

- Inspection of pseudo solders for lead-free solder joints in PCBs
- Optics and Precision Engineering Vol. 19, Issue 3, Pages: 697-702(2011)
- 作者机构：
  
  1. 华南理工大学机械与汽车工程学院, 广东广州 510640
  2. 汕头大学机械电子工程系,广东汕头 515063
- 作者简介：
- 基金信息：
- DOI：10.3788/OPE.20111903.0697
  CLC： TP274.5;TP391.4
- Received：25 September 2010，
  
  Revised：27 October 2010，
  
  Published Online：22 March 2011，
  
  Published：22 March 2011
- 稿件说明：
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吴福培, 张宪民. 印刷电路板无铅焊点假焊的检测[J]. 光学精密工程, 2011,19(3): 697-702

WU Fu-pei, ZHANG Xian-min. Inspection of pseudo solders for lead-free solder joints in PCBs[J]. Editorial Office of Optics and Precision Engineering, 2011,19(3): 697-702
吴福培, 张宪民. 印刷电路板无铅焊点假焊的检测[J]. 光学精密工程, 2011,19(3): 697-702 DOI： 10.3788/OPE.20111903.0697.

WU Fu-pei, ZHANG Xian-min. Inspection of pseudo solders for lead-free solder joints in PCBs[J]. Editorial Office of Optics and Precision Engineering, 2011,19(3): 697-702 DOI： 10.3788/OPE.20111903.0697.

摘要

通过分析由三色LED环形结构光源和3-CCD彩色相机获取的印刷电路板(PCB)焊点图像特征

设计了一种PCB无铅焊点假焊的检测方法

以提高自动光学检测系统检测焊点质量的准确率

降低误判。该方法通过对焊点及其元器件的定位

采用重心法检测假焊;根据焊点及元器件的边缘确定焊点区域及元器件区域

采用面积法二次检测假焊;最后

采用提出的色彩梯度法

检测剩余的假焊焊点。基于以上三步骤

实现对整张PCB焊点假焊的检测。实验结果表明

采用重心法、面积法及色彩梯度法相结合的方法

可检测出PCB焊点的假焊

检测准确率为99.2%。

Abstract

In order to improve the inspection accuracy and reduce misjudgment rate for the solder joint quality inspection in an automatic optical inspection system

a pseudo solder joint inspection method for lead-free solder joints in a Printed Circuit Board(PCB) was proposed based on analyzing the solder joint image acquired by a 3-color LED structure illuminator and a color 3-CCD camera. Three steps were used to detect the pseudo solder joints. Pseudo solder joints were inspected firstly by the center of gravity method after positioning the solder joints and its components. Then

the regions of solder joints and components were figured out based on their edge

and the area method was used to inspect pseudo solder joints. Finally

the missed pseudo solder joints were inspected by the proposed color grad method. The experiment results show that the proposed method composed of the center of gravity method

area method and the color grad method can inspect the pseudo solders effectively

and the inspection accuracy can reach 99.2%.

关键词

Keywords

references

LIN S C, SU C H. A visual inspection system for surface mounted devices on printed circuit board . Cybernetics and Intelligent Systems, 2006 IEEE Conference, 2006:1-4.[2] LOH H H, LU M S. Printed circuit board inspection using image analysis[J]. IEEE Transactions on Industry Applications, 1999,35(2):426-432.[3] KIM T H , CHO T H, MOON Y S, et al.. Visual inspection system for the classification of solder joints[J]. Pattern Recognition,1999,32(4):565-575.[4] JAGANNATHAN S. Automatic inspection of wave soldered joints using neural networks[J]. Journal of Manufacturing Systems, 1997,16(6):389-398.[5] KO K W, CHO H S. Solder joints inspection using a neural network and fuzzy rule-based classification method [J]. IEEE Transactions on Electronics Packaging Manufacturing, 2000, 23(2):93-102.[6] ACCIANI G, BRUNETTI G, FORNARELLI G. Application of neural networks in optical inspection and classification of solder joints in surface mount technology[J]. IEEE Transactions on Industrial Informatics, 2006,2(3):200-209.[7] 卢盛林,张宪民,邝泳聪. 基于神经网络的PCB焊点检测方法[J]. 华南理工大学学报(自然科学版),2008,36(5):135-139. LU SH L, ZHANG X M, KUANG Y C. Neural network-based inspection method of PCB solder joint[J]. Journal of South China University of Technology (Natural Science Edition), 2008, 36(5):135-139. (in Chinese)[8] 吴福培,张宪民. SMT炉后晶体管类元件无铅焊点的自动光学检测算法[J]. 焊接学报, 2009,30(7):5-8. WU F P, ZHANG X M. An AOI algorithm for transistor lead-free solder joint of SMT[J]. Transactions of the China Welding Institution, 2009,30(7):5-8.[9] 吴福培,张宪民. 基于模式匹配及其参数自适应的PCB焊点检测算法[J]. 光学精密工程,2009,17(10):2586-2593. WU F P, ZHANG X M. Pattern matching and parameter adaptive based PCB solder joint inspection[J]. Opt. Precision Eng., 20089,17(10):2587-2593. (in Chinese)[10] 卢盛林,张宪民. 无铅焊点检测的光源分析与优化设计[J]. 光学精密工程,2008,16(8):1377-1383. LU S L, ZHANG X M. Analysis of optimal design of illuminator for leafless tin solder joint inspection [J]. Opt. Precision Eng., 2008,16(8):1377-1383. (in Chinese)[11] 吴福培,张宪民. 基于灰度积分投影法对无铅焊点的鲁棒定位[J]. 华南理工大学学报(自然科学版) 2009,37(9):98-102. WU F P, ZHANG X M. Robust positioning algorithm of lead-free solder joints based on gray-level integration projection[J]. Journal of South China University of Technology (Natural Science Edition), 2009,37(9):98-102. (in Chinese)

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