LEE S J, LEE S Y. Micro total analysis system (mu-TAS) in biotechnology[J]. Applied Microbiology and Biotechnology,2004,64:289-299.[2] BOHM S, DILGER K, HESSELBACH J, et al.. Micro bonding with non-viscous adhesives [J].Microsystem. Technologies,2006,12(7):676-679.[3] LI J H, CHEN D, CHEN G. Low-temperature thermal bonding of PMMA microfluidic chips [J].Analytical Letters,2005,38(7):1127-1136.[4] USSING T, PETERSEN L V, NIELSEN C B, et al.. Micro laser welding of polymer microstructures using low power laser diodes [J].International Journal of Advanced Manufacturing Technology,2007,33(1-2):198-20.[5] YUSSUF A A, SBARSKI I, HAYES J P, et al.. Microwave welding of polymeric-microfluidic divices [J].Journal of Micromechanics and Microengineering,2005,15:1692-1699.[6] TRUCKENM LLER R,AHRENS R,CHENG Y, et al.. An ultrasonic welding based process for building up new class of inert fluidic microsensors and actuators from polymers[J]. Sensors and Actuators,2006,132(1):385-392.[7] KIM J, JEONG B, CHIAO M. Ultrasonic bonding for MEMS sealing and packaging[J]. IEEE Transactions on Advanced Packaging,2009,32(2):461-467.[8] NG S H, WANG Z F, ROOIJ N F de. Microfluidic connectors by ultrasonic welding[J].Microelectronic Engineering,2009,86(4-6):1354-1357.[9] 刘川.超声波塑料焊接机理和工艺试验研究 . 大连:大连理工大学, 2003. LIU CH. The mechanism of ultrasonic plastic welding and the study of experiments .Dalian:Dalian University of Technology,2003. (in Chinese)[10] RANI M R, PRAKASAN K,RUDRAMOORTHY R. Study of different joints for ultrasonic welding of semicrystalline polymers[J].Experimental Techniques, 2009(7/8):36-42.[11] QIU J H, ZHANG G H, WU Y B. Proposal of ultrasonic welding technique and weld performances applied to polymers[J]. Polymer Engineering and Science. 2009(12):1755-1759.[12] PAUL B C, JUNJIE W,HAUGHIE D W. The integrity of welded interfaces in ultra high molecular weight polyethylene: part 1Model[J]. Biomaterials, 2006(6):3178-3186.[13] HAUGHIE D W,PAUL B C,JUNJI W. The integrity of welded interfaces in ultra-high molecular weight polyethylene: part 2Interface toughness[J]. Biomaterials, 2006(7):3875-3881.[14] 孙屹博,罗怡,王晓东. 聚合物微器件压力自适应超声波精密联接[J]. 光学 精密工程,2010,18(5):1189-1195. SUN Y B, LUO Y, WANG X D. Ultrasonic precise bonding for polymer micro device based on adaptive pressure control[J]. Opt. Precision Eng.,2010,18(5):1189-1195.(in Chinese)[15] BENATAR A, ESWARAN R V, NAYAR S K. Ultrasonic welding of thermoplastics in the near-field[J]. Polymer Engineering and Science.1989,29(23):1689-1698.[16] 陶琳,罗怡,张彦国,等. 超声波键合能量引导微结构PMMA基片的制作[J]. 光学 精密工程,2009,17(6):1373-1378. TAO L, LUO Y, ZHANG Y G, et al.. Fabrication of micro energy director on polymethyl methacrylate substrate for micro ultrasonic bonding[J]. Opt. Precision Eng.,2009,17(6):1373-1378.(in Chinese)[17] 罗怡,王晓东,杨帆,等. 变温蠕变实验的COP微流控芯片热压制备[J]. 光学 精密工程,2007,15(7):1090-1095. LUO Y, WANG X D, YANG F, et al.. Variable temperature quasi-creep experiment for fabrication of microfluidic chip using Cyclo-olefin Polymer (COP) [J]. Opt. Precision Eng.,2007,15(7):1090-1095.(in Chinese)[18] 何曼君,张红东,陈维孝,等.高分子物理 [M]. 上海:复旦大学出版社,2007:232-239. HE M J,ZHANG H D,CHEN W X, et al.. High Polymer Physics [M].Shanghai:The publisher of Fudan University,2007:232-239.(in Chinese)