Application of ultrasonic stress relief technology to microinjection mold fabrication

DU Li-qun; LI Cheng-bin; LI Yong-hui; YU Tong-min

doi:10.3788/OPE.20122006.1250

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Application of ultrasonic stress relief technology to microinjection mold fabrication

更新时间：2020-08-12

- Application of ultrasonic stress relief technology to microinjection mold fabrication
- Optics and Precision Engineering Vol. 20, Issue 6, Pages: 1250-1256(2012)
- 作者机构：
  
  1. 大连理工大学精密与特种加工教育部重点实验室,辽宁大连,116023
  2. 大连理工大学辽宁省微纳米及系统重点实验室,辽宁大连,116024
- 作者简介：
- 基金信息：
- DOI：10.3788/OPE.20122006.1250
  CLC： TB559;TN305
- Received：03 February 2012，
  
  Revised：22 February 2012，
  
  Published Online：10 June 2012，
  
  Published：10 June 2012
- 稿件说明：
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杜立群, 李成斌, 李永辉, 于同敏. 超声时效技术在微注塑模具制作中的应用[J]. 光学精密工程, 2012,20(6): 1250-1256

DU Li-qun, LI Cheng-bin, LI Yong-hui, YU Tong-min. Application of ultrasonic stress relief technology to microinjection mold fabrication[J]. Editorial Office of Optics and Precision Engineering, 2012,20(6): 1250-1256
杜立群, 李成斌, 李永辉, 于同敏. 超声时效技术在微注塑模具制作中的应用[J]. 光学精密工程, 2012,20(6): 1250-1256 DOI： 10.3788/OPE.20122006.1250.

DU Li-qun, LI Cheng-bin, LI Yong-hui, YU Tong-min. Application of ultrasonic stress relief technology to microinjection mold fabrication[J]. Editorial Office of Optics and Precision Engineering, 2012,20(6): 1250-1256 DOI： 10.3788/OPE.20122006.1250.

摘要

针对金属微注塑模具UV-LIGA制作过程中由于SU-8胶内应力过大而引起的胶膜破裂、变形甚至脱落等问题

提出将超声时效技术应用于微注塑模具的制作工艺。首先

利用紫外光刻工艺制备了电铸胶膜

在显影前使用自制的超声时效装置对胶膜进行超声处理。然后

采用无背板生长方法在38CrNiMnMo模具钢基底上直接进行镍金属的电铸生长

讨论并解决了工艺过程中遇到的SU-8胶浮胶变形、非圆形基片的匀胶、胶膜中的气泡以及微电铸层结合不牢等问题。最后

制作出微通道宽度和高度分别为80 μm和35 μm的微注塑模具。实验结果表明

超声时效技术的使用避免了由于SU-8胶内应力过大引起的破裂、变形甚至从基底脱落等缺陷

增强了UV-LIGA技术制作微注塑模具的能力

提高了制作微注塑模具的成功率。

Abstract

In the UV-LIGA fabrication process of a microinjection metal mold

the large internal stress of a SU-8 layer can result in SU-8 mould defects such as micro cracks

distortion or even exfoliation. In order to avoid these defects

the ultrasonic stress relief technology was introduced into the microinjection process. First

the SU-8 mould was obtained by coating

soft baking

ultraviolet exposure and post-exposure baking

and it was treated by the ultrasonic stress relief equipment before developing. Then the backless plate growing method was adopted to directly fabricate the nickel micro-electroforming pattern on a 38CrNiMnMo mould steel substrate and the SU-8 layer defects emerged in the process such as the distortion and exfoliation in the SU-8 spin coating on a non-circular substrate

the air bubbles in photoresist layer and the adhesion of plating layer with the substrate were eliminated or improved. Finally

the microinjection mold with a channel width of 80 μm and a height of 35 μm was fabricated. The results show that by using the ultrasonic stress relief technology

the SU-8 mould defects caused by large internal stress in SU-8 layer are overcome

the capacity of manufacturing microinjection mold via UV-LIGA technology is enhanced

and the success rate of microinjection mold fabrication is greatly improved.

关键词

Keywords

references

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大连理工大学精密与特种加工教育部重点实验室

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Department of Precision Mechinery and Precision Instrumentation, University of Science and Technology of China

National Synchrotron Radiation Laboratory,University of Science and Technology of China

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