Design of optical structure for chip-on-board wafer level packaging LEDs

MA Jian-She; HE Li-yun; LIU Tong; SU Ping

doi:10.3788/OPE.20132104.0904

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Design of optical structure for chip-on-board wafer level packaging LEDs

更新时间：2020-08-12

- Design of optical structure for chip-on-board wafer level packaging LEDs
- Optics and Precision Engineering Vol. 21, Issue 4, Pages: 904-910(2013)
- 作者机构：
  
  清华大学深圳研究生院
- 作者简介：
- 基金信息：
- DOI：10.3788/OPE.20132104.0904
  CLC： TN312.8
- Received：04 September 2012，
  
  Revised：05 December 2012，
  
  Published Online：20 April 2013，
  
  Published：15 April 2013
- 稿件说明：
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马建设贺丽云刘彤苏萍. 板上芯片集成封装的发光二极管结构设计[J]. 光学精密工程, 2013,21(4): 904-910

MA Jian-She HE Li-yun LIU Tong SU Ping. Design of optical structure for chip-on-board wafer level packaging LEDs[J]. Editorial Office of Optics and Precision Engineering, 2013,21(4): 904-910
马建设贺丽云刘彤苏萍. 板上芯片集成封装的发光二极管结构设计[J]. 光学精密工程, 2013,21(4): 904-910 DOI： 10.3788/OPE.20132104.0904.

MA Jian-She HE Li-yun LIU Tong SU Ping. Design of optical structure for chip-on-board wafer level packaging LEDs[J]. Editorial Office of Optics and Precision Engineering, 2013,21(4): 904-910 DOI： 10.3788/OPE.20132104.0904.

摘要

根据板上芯片（COB）集成封装的结构特点，同时考虑反光杯结构和荧光粉涂敷方式，分析了影响COB封装的发光二极管（LED）发光性能的主要因素。针对反光杯结构的关键要素：反光杯形状、反光杯深度、反光杯角度，优化设计了LED光学结构。通过改变TracePro软件中反光杯的相关参数，模拟了不同LED的光强分布及发光效率，探讨了提高COB封装的白光LED发光效能的途径。最后，在4 mA和12 mA电流下进行了传统荧光粉涂敷方式及荧光粉远离芯片涂敷方式的对照实验。仿真及实验结果表明：采用圆锥形反光杯，反光杯深度在一定范围内略大，且反光杯角度设为30时，LED发光性能较为优异。与传统封装方法相比，采用荧光粉远离芯片的封装方法可使发光效率提高5%左右。得到的结果对LED封装制造过程有指导意义。

Abstract

According to the characteristics of Chip-on-board (COB) packaging structure and considering the reflective cup structure and fluorescent powder coating methods

the main factors impacting the light emitting properties of a COB packaged Light Emitting Diode(LED) were analyzed. On the basis of the several key elements of reflective cup structure

indluding its shape

depth

and angle

this paper optimized the design of LED optical structure. By changing the relevant parameters of reflective cup in TracePro software

the light intensity distributions and output efficiencies of different LEDs were simulated

and the approach to improve the light luminescence properties of a COB packaged white LED was discussed. Finally

the contrast experiments on a traditional phosphor coating method and a coating method with phosphors away from the LED chip were performed under drive currents of 4 mA and 12 mA

respectively. The simulation and experimental results show that the luminous performance is more excellent in the reflective cup with a conical shape

a bigger depth in a certain range and a angle of 30 . As compared with traditional packaging method

the coating method with phosphors away from the LED chip can improve the luminous efficiency by more than 5%. It has certain guiding significance for the LED packaging manufacturing process.

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references

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