LIU Hua-song WANG Li-shuan JIANG Yu-gang JI Yi-qin. Adjustments of refractive index and stress of SiO2 films prepared by IBS technology[J]. Editorial Office of Optics and Precision Engineering, 2013,21(9): 2238-2243
LIU Hua-song WANG Li-shuan JIANG Yu-gang JI Yi-qin. Adjustments of refractive index and stress of SiO2 films prepared by IBS technology[J]. Editorial Office of Optics and Precision Engineering, 2013,21(9): 2238-2243 DOI: 10.3788/OPE.20132109.2238.
Adjustments of refractive index and stress of SiO2 films prepared by IBS technology
The effects of preparative parameters such as substrate temperature
ion beam voltage
ion beam current and oxygen flow on the refractive index and stress of a SiO2 thin film were systematically studied by using the orthogonal experiment design method. The transmittance spectrum of SiO2 thin film was measured by spectrophotometers
and its reflective ellipsometric characteristics were measured by an elliptical polarization instrument. Then
the refractive index and stress of the thin film were obtained by the multiple wavelength curve-fitting method and the elastic deformation of a thin film-substrate system
respectively. The experimental results show that the refractive indexes of SiO2 thin film affected by preparative parameters with the weights from high to low are in a sequence of oxygen flow
substrate temperature
ion beam current and ion beam voltage and the confidence probability of effects of the first three refractive indexes is 87.03%
71.98% and 69.53%
respectively. Moreover
the stresses of SiO2 thin film affected by preparative parameters with the weights from high to low are in a sequence of substrate temperature
ion beam current
ion beam voltage and oxygen flow and the confidence probability of effects of the first three stresses is 95.62%
48.49% and 37.88%
respectively. It suggests that higher oxygen flows
lower substrate temperatures and lower ion beam voltages should be selected for preparing SiO2 thin films with low refractive indexes and lower substrate temperatures
and higher oxygen flows for preparing SiO2 thin films with low stresses.
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references
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