QI Na, LUO Yi, WANG Xiao-dong etc. Mechanism and avoiding of polymer melting on non-forming surface during ultrasonic embossing[J]. Editorial Office of Optics and Precision Engineering, 2015,23(2): 452-458
QI Na, LUO Yi, WANG Xiao-dong etc. Mechanism and avoiding of polymer melting on non-forming surface during ultrasonic embossing[J]. Editorial Office of Optics and Precision Engineering, 2015,23(2): 452-458 DOI: 10.3788/OPE.20152302.0452.
Mechanism and avoiding of polymer melting on non-forming surface during ultrasonic embossing
This paper analyzes the reason why the polymer is melted on a non-forming surface during ultrasonic embossing and proposes a method to inhibit the polymer melting. On the basis of the heating mechanism of ultrasonic
it points out that the polymer melting phenomenon on non-forming surface is resulted by the friction in a horn-substrate interface. Then
it proposed the method "two interfaces of different friction coefficients" to inhibit the polymer melting and implemented the method by coatings surface protection films on the non-forming surface. To optimize the protection films
and the influences of the four coating film conditions on the softening time are examined through Taguchi method. The results show that the Sekisui #622E-50 film shortens the softening time by 3.4 s and the Sekisui #622WB film reduces the softening time error by 0.64 s. It demonstrates that surface protection films coated can avoid polymer melting on the non-forming surface
and improve the process replication ability and the process stability in ultrasonic embossing.
LUO Y, WANG X D, YANG F, et al.. Variable temperature quasi-creep experiment for fabrication of microfluidic chip using Cycio-Olefin Polymer (COP) [J]. Opt. Precision Eng., 2007, 15(7): 1090-1095. (in Chinese)
SONG M C, LIU Y, ZHU T L, et al.. Injection molding of plastic microfluidic chip [J]. Nanotechnology and Precision Engineering, 2011, 9(4): 229-334.(in Chinese)
JIANG B Y, SHEN R X, SHEN L J, et al.. Influence of processing parameters in injection molding on replication fidelity of microstructure parts[J]. Opt. Precision Eng., 2008, 16(2): 249-256. (in Chinese)
YANG L X, HAO X J, WANG CH SH, et al.. Three-dimensional focusing microfluidic chip [J]. Opt. Precision Eng., 2013, 21(9): 2309-2316. (in Chinese)
YANG C,YIN X H,CHENG G M. Microinjection molding of microsystem components: new aspects in improving performance [J]. J. Micromech. Microeng, 2013, 23: 093001.
LIU SH J,DUNG Y T. Hot embossing precise structure on to plastic plates by ultrasonic vibration [J]. Polymer Engineering and Science, 2005: 915-925.
LIU SH J,HUANG Y CH,YANG S Y, et al.. Rapid fabrication of surface-relief plastic diffusers by ultrasonic embossing [J]. Optics & Laser Technology, 2010, 42: 794-798.
LIU S J,HUANG Y C. Manufacture of dual-side surface-relief diffusers with various cross angles using ultrasonic embossing technique [J]. Optics Express, 2009, 17(20): 18083.
YOUNG H C, YOUNG S S, YONG M, et al.. Facile fabrication of superhydrophobic poly(methyl methacrylate) substrates using ultrasonic imprinting [J]. J. Micromech. Microeng, 2013,23:055019-1-7.
HARUTAKA M,MASAHARU T. Ultrasonic nanoimprint on engineering plastics [J]. J. Vac. Sci. Technol. A., 2009, 27(4): 785-792.
LIN CH H,CHEN R SH. Ultrasonic nanoimprint lithography: a new approach to nanopatterning [J]. Microlith., Microfab., Microsyst., 2006, 5(1): 011003-1-6.
LIN CH H,WANG CH Y,CHEN R SH. Assisted-heating for ultrasonic nanoimprint lithography [C]. 9th IEEE Conference on Nanotechnology, 2009.
HARUTAKA M, OSAMU N, OSAMU M, et al.. Development of precision transfer technology of atmospheric hot embossing by ultrasonic vibration [J]. Microsyst Technol., 2007, 13:385-391.
HARUTAKA M, HIROSHI G, MASAHARU T. Development of ultrasonic micro hot embossing technology [J]. Microelectronic Engineering, 2007, 84:1282-1287.
HARUTAKA M, TOSHIHIKO N, HIROSHI G, et al.. Effect of applying ultrasonic vibration in thermal nanoimprint lithography[J]. Microsyst Technol., 2008, 14:1325-1333.
LI Y X, LI Y Q, QU L L,et al.. Microfluidic chip electrophoresis with laser-induced fluorescence detection for rapid analysis of four foodborne pathogenic bacteria [J]. Chinese Journal of Analytical Chemistry, 2008,36(12): 1667-1671. (in Chinese)
ZHANG Z B,WANG X D,LUO Y, et al.. Study on heating process of ultrasonic welding for thermoplastics[J]. J. Thermoplast Compos. Mater., 2009, 23:647-664.