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Photoelectric parameter measurement system for chip-on-board wafer level packaging LEDs
更新时间:2020-08-13
    • Photoelectric parameter measurement system for chip-on-board wafer level packaging LEDs

    • Optics and Precision Engineering   Vol. 24, Issue 1, Pages: 39-44(2016)
    • DOI:10.3788/OPE.20162401.0039    

      CLC: TN312.8;TB96
    • Received:14 August 2015

      Revised:10 October 2015

      Published:25 January 2016

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  • QIU Yan-qing, ZHANG Liu-liu, CHEN Miao-gen etc. Photoelectric parameter measurement system for chip-on-board wafer level packaging LEDs[J]. Editorial Office of Optics and Precision Engineering, 2016,24(1): 39-44 DOI: 10.3788/OPE.20162401.0039.

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