Thermal field distribution in fly-cutting of KDP crystal and its influence on chip morphology

Sheng-fei WANG; Chen-hui AN; Fei-hui ZHANG; Wu YOU; Xiang-yang LEI

doi:10.3788/OPE.20162408.1948

您当前的位置：

首页 >

文章列表页 >

Thermal field distribution in fly-cutting of KDP crystal and its influence on chip morphology

Micro/Nano Technology and Fine Mechanics | 更新时间：2020-07-07

- Thermal field distribution in fly-cutting of KDP crystal and its influence on chip morphology
- Optics and Precision Engineering Vol. 24, Issue 8, Pages: 1948-1955(2016)
- 作者机构：
  
  1.哈尔滨工业大学机电工程学院, 黑龙江哈尔滨 150001
  2.成都精密光学工程研究中心, 四川成都 610041
- 作者简介：
- 基金信息：
- DOI：10.3788/OPE.20162408.1948
  CLC： O786;O734.1
- Received：11 March 2016，
  
  Accepted：15 April 2016，
  
  Published：25 August 2016
- 稿件说明：
移动端阅览
Sheng-fei WANG, Chen-hui AN, Fei-hui ZHANG, et al. Thermal field distribution in fly-cutting of KDP crystal and its influence on chip morphology[J]. Optics and precision engineering, 2016, 24(8): 1948-1955.
DOI：

Sheng-fei WANG, Chen-hui AN, Fei-hui ZHANG, et al. Thermal field distribution in fly-cutting of KDP crystal and its influence on chip morphology[J]. Optics and precision engineering, 2016, 24(8): 1948-1955. DOI： 10.3788/OPE.20162408.1948.

摘要

研究了磷酸二氢钾(KDP)晶体飞切加工过程中温度场的分布，探索了切削温度对KDP晶体切削过程的影响。首先，采用热力耦合有限元分析对KDP晶体切削过程进行了仿真，获得了不同切削深度下材料内部温度场的分布。分别使用飞切机床和纳米压痕仪在不同速度下切削KDP晶体，发现不同切削速度下形成的切屑的微观形貌存在显著差异，分析指出这可能是由于在不同切削速度下切削区域温度差异导致的。最后，对低速加工过程中获得的切屑进行加热试验，并观测了不同温升条件下切屑微观形貌的变化。飞切加工仿真实验显示：当切深为200 nm时，切削区域的温度达到110 ℃；而实际实验结果表明：当温度超过100 ℃时，切屑的微观形貌会发生明显变化。综合仿真及实验结果可知：在KDP晶体飞切加工过程中切削区域的温度将超过100 ℃，因此在对KDP晶体切削机理进行研究时，必须考虑温度对材料力学性能及其去除过程的影响。

Abstract

This paper researches the thermal field distribution of a Potassium Dihydrogen Phosphate (KDP) crystal in fly-cutting process

and explores the influence of cutting temperature on the fly-cutting process of KDP crystal. Firstly

the thermal-mechanical coupled Finite Element Method(FEM) was conducted to simulate the fly-cutting process of KDP crystal and to obtain the temperature fields under different cutting depths. Then

a fly-cutting machine and a nanoindentation instrument were used to cut the KDP crystal at different speeds. It was found that the microscopic morphologies of the chip formed under different cutting speeds are greatly different

and this may result from the different temperature rises at different cutting speeds. Finally

the chip formed under lower cutting speed was heated at different temperatures and the morphology of the heated chip was observed. The simulation results demonstrate that the temperature in the cutting zone rises to as much as 110 ℃ when the cutting depth increases to 200 nm. Moreover

the experiment results indicate that the chip morphology will change at 100 ℃. It concludes by simulation and experiments that the maximum temperature exceeds 100 ℃ in fly-cutting of KDP crystal. So

it suggests that the effect of cutting temperature on the mechanical property and removal process in fly-cutting of KDP crystal should be considered.

关键词

Keywords

references

GUO D CH, JIANG X D, HUANG J, et al.. Effect of UV laser conditioning on the structure of KDP crystal [J]. Advances in Condensed Matter Physics, 2014, 7: 1-7.

CHEN M J, LI M Q, JIANG W, et al.. Influence of period and amplitude of microwaviness on KH2PO4 crystal's laser damage threshold [J]. Journal of Applied Physics, 2010.

KATAGIRI, NAMBA M Y. Optical surface generation of KDP inorganic nonlinear optical crystals by ultra precision surface grinding [J]. The Japan Society for Precision Engineer, 1999, 65: 888-892.

MENAPACE J A, EHRMANN P R, BICKEL R C. Magnetorheological finishing (MRF) of potassium dihydrogen phosphate (KDP) crystals: nonaqueous fluids development, optical finish, and laser damage performance at 1064 nm and 532 nm [C].

CHEN H F, DAI Y F, ZHENG Z W, et al.. Effect of crystallographic orientation on cutting forces and surface finish in ductile cutting of KDP crystals [J]. International Journal of Machining Science and Technology, 2011, 15 (2): 231-242.

张文生, 张飞虎, 董申. 光学脆性材料的金刚石切削加工[J]. 光学精密工程, 2003, 11(2), 139-143.

ZHANG W S, ZHANG F H, DONG SH. Diamond cutting of optical brittle materials [J]. Opt. Precision Eng., 2003, 11(2), 139-143. (in Chinese)

PATURI U M R, NARALA S K R, PURDER R S. Constitutive flow stress formulation, model validation and FE cutting simulation for AA7075-T6 aluminum alloy [J]. Materials Science & Engineering A, 2014, 605: 176-185.

周明, 邹莱. 金刚石切削黑色金属时刀具磨损机理的摩擦磨损试验[J]. 光学精密工程, 2013, 21(7): 1786-1794.

ZHOU M, ZOU L. Tool wear mechanism of diamond cutting of ferrous metals in frictional wear experiment [J]. Opt. Precision Eng., 2013, 21(7): 1786-1794.

ZHAO Q L, WANG Y L, YU G, et al.. Investigation of anisotropic mechanisms in ultra-precision diamond machining of KDP crystal [J]. Journal of Materials Processing Technology, 2009, 209: 4169-4177.

MYLVAGANAM K, ZHANG L, ZHANG Y. Stress-induced phase and structural changes in KDP crystals [J]. Computational Materials Science, 2015, 109: 359-366.

TIE G, DAI Y, GUAN C, et al.. Research on the full-aperture ductile cutting of KDP crystals using spiral turning technique [J]. Journal of Materials Processing Technology, 2013, 213 (12): 2137-2144.

LLANOS I, VILLAR J A, URRESTI I, et al.. Finite element modeling of oblique machining using an Arbitrary Lagrangian Eulerian formulation[J]. International Journal of Machining Science and Technology, 2013, 13: 385-406.

ZHANG Y, ZHANG L, LIU M, et al.. Understanding the friction and wear of KDP crystal by nanoscratching [J]. Wear, 2015, 332-333: 900-906.

汪圣飞, 安晨辉, 张飞虎, 等. 基于纳米划痕实验和有限元仿真的KDP晶体断裂性能研究[J]. 人工晶体学报, 2015, 44 (9): 1-5.

WANG SH F, AN CH H, ZHANG F H, et al.. Study on the fracture mechanism of KDP crystal by nanoscratch experiment and FE simulation [J]. Journal of Synthetic Crystals, 2015, 44 (9): 1-5. (in Chinese)

COURBON C, MABROUKI T, RECH J, et al.. Further insight into the chip formation of ferritic-pearlitic steels: Microstructural evolutions and associated thermo-mechanical loadings [J]. International Journal of Machine Tools & Manufacture, 2014, 77: 34-46.

Views

下载量

CSCD

Alert me when the article has been cited

提交

Tools

Publicity Resources

Measurement of bulk defects for KDP crystal billet with focused line scanning

Related Author

Kai-zao NI

Shi-jie LIU

Zhou-ling WU

Jian CHEN

Related Institution

Key Laboratory of Materials for High Power Laser, Shanghai Institute of Optics and Fine Mechanics, Chinese Academy of Sciences

ZC Optoelectronic Technologies. Co., Ltd.

AI问答

Address：No.3888 Dong Nanhu Road, Changchun, Jilin, China Postal code：130033
Tel：0431-86176855 Email：gxjmgc@ciomp.ac.cn
Technical support is provided by Beijing Founder electronics co., LTD 吉ICP备11002662号-17 京公网安备11010802024621
It is recommended to read the content of this site in Chrome&IE9+. Please switch to extreme mode in browser 360.
Cookies We use cookies to help provide and enhance our service and tailor content. By continuing, you agree to the use of cookies.

⁰