Material removal mechanism study of ultrasonic elliptical vibration assisted chemical mechanical polishing for fiber end-face

CHEN Tao; LIU De-fu; YAN Ri-ming; YU Qing

doi:10.3788/OPE.20162413.0493

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Material removal mechanism study of ultrasonic elliptical vibration assisted chemical mechanical polishing for fiber end-face

更新时间：2020-08-13

- Material removal mechanism study of ultrasonic elliptical vibration assisted chemical mechanical polishing for fiber end-face
- Optics and Precision Engineering Vol. 24, Issue 10s, Pages: 493-502(2016)
- 作者机构：
  
  1. 中南大学机电工程学院, 湖南长沙 410083
  2. 高性能复杂制造国家重点试验室, 湖南长沙 410083
- 作者简介：
- 基金信息：
- DOI：10.3788/OPE.20162413.0493
  CLC： TB559;TG356.2+8
- Received：20 April 2016，
  
  Revised：17 May 2016，
  
  Published：14 November 2016
- 稿件说明：
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陈涛, 刘德福, 严日明等. 超声椭圆振动辅助化学机械抛光光纤端面的材料去除机理研究[J]. 光学精密工程, 2016,24(10s): 493-502

CHEN Tao, LIU De-fu, YAN Ri-ming etc. Material removal mechanism study of ultrasonic elliptical vibration assisted chemical mechanical polishing for fiber end-face[J]. Editorial Office of Optics and Precision Engineering, 2016,24(10s): 493-502
陈涛, 刘德福, 严日明等. 超声椭圆振动辅助化学机械抛光光纤端面的材料去除机理研究[J]. 光学精密工程, 2016,24(10s): 493-502 DOI： 10.3788/OPE.20162413.0493.

CHEN Tao, LIU De-fu, YAN Ri-ming etc. Material removal mechanism study of ultrasonic elliptical vibration assisted chemical mechanical polishing for fiber end-face[J]. Editorial Office of Optics and Precision Engineering, 2016,24(10s): 493-502 DOI： 10.3788/OPE.20162413.0493.

摘要

为了描述超声振动辅助化学机械抛光光纤端面过程中材料的去除机理，建立了超声振动辅助化学机械抛光过程中光纤材料去除模型。根据实验观察的抛光垫的表面形貌合理地建立抛光垫表面形貌的数学模型；接着，分析抛光过程中的两体三体接触的抛光粒子数目；分析不同方向的超声振动在化学机械抛光过程中去除光纤材料的机理，综合考虑抛光粒子及工件的材料特性、超声振动特性，分别建立了不同工艺下的材料去除模型；对比光纤端面的超声振动辅助化学机械抛光实验结果与理论计算结果，以验证模型的可靠性。实验结果表明：UHV-CMP、UVV-CMP、UEV-CMP相较于普通CMP对光纤的材料去除率分别提升60%、85.6%和145%。结论：超声振动有利于提高光纤端面的化学机械抛光材料去除率，且理论与实验对比结果较为吻合，验证了材料去除模型的可靠性。

Abstract

To describe material removal mechanism in the process of auxiliary chemico-mechanical polishing fiber end face of ultrasonic vibration

Fiber material removal model in the auxiliary chemico-mechanical polishing process of ultrasonic vibration is established; Reasonably establish mathematical model of surface appearance of polishing pad according to surface appearance of polishing pad of experimental observation; Analyze polishing particle number of two-body and three-body contact in the process of polishing and analyze fiber material removal mechanism of ultrasonic vibration of different directions in the chemico-mechanical polishing process; Respectively establish material removal model under different process after overall consideration of polishing particle

workpiece material characteristic and ultrasonic vibration characteristic; Compare experimental result of auxiliary chemico-mechanical polishing of ultrasonic vibration on fiber end face and theoretical calculation result to verify reliability of model. Result:experimental result shows that compared with ordinary CMP

fiber material removal rate of UHV-CMP

UVV-CMP and UEV-CMP respectively increases by 60%

85.6% and 145%. Conclusion:ultrasonic vibration helps to improve material removal rate of chemico-mechanical polishing on fiber end face

and theoretical and experimental comparison results are relatively identical

which verifies reliability of material removal model.

关键词

Keywords

references

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